Electronics Forum | Fri Jul 10 13:16:27 EDT 1998 | Bill Schreiber
To electropolish or not to nickel plate, that is the question. Whether it be nobler in the minds of the competition could be the answer. I think it will probably depend upon whom you ask the question. If the stencil mfgr. has nichel plating capibil
Electronics Forum | Mon Jul 20 23:40:31 EDT 1998 | Alex Ondi
| To electropolish or not to nickel plate, that is the question. Whether it be nobler in the minds of the competition could be the answer. | I think it will probably depend upon whom you ask the question. If the stencil mfgr. has nichel plating cap
Electronics Forum | Tue May 26 14:50:07 EDT 1998 | Dave F
| | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and sol
Electronics Forum | Tue Nov 01 15:26:43 EST 2005 | GS
Is it this your first experience of C-CGA RWK ? In order to approach a RWK of this kind of pakage it requires a capable process and clear operating procedure. In the past, the company who I use to work for, we rwkd plenty of this kind of CCGA. Earl
Electronics Forum | Fri Aug 13 13:47:52 EDT 1999 | Brian Wycoff
| | | | | Hello | | | | | | | | | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | | | | | 100 durometer
Electronics Forum | Fri Aug 13 13:50:53 EDT 1999 | Brian Wycoff
| | | | | | Hello | | | | | | | | | | | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | | | | | | 100 du
Electronics Forum | Fri Jul 16 14:05:04 EDT 1999 | Jim Blankenhorn
| | | Hi all , | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | 2. What type of stencil apertures are t
Electronics Forum | Tue Jun 08 15:04:06 EDT 1999 | JohnW
| | | Hi,my master | | | How to iron out such soldering bridge with below conditions: | | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | | 3.using s
Electronics Forum | Sun Apr 25 04:34:09 EDT 1999 | Earl Moon
No this message isn't about my triumphant return. It's not even about that lady I wanted to run away with to Mehico (who were you again). It's about progress and some of you might be interested, or not. 1) For DEKheads, I submit we had two of Britai
Electronics Forum | Sun Apr 18 00:47:11 EDT 1999 | Steve Gregory
Yeah Earl, I hear ya... I registered, but did so rather grudgingly. Ya'll must've noticed that I haven't been here much lately. I really haven't thought much about why, but maybe it's been a subconscious thing...like it's too much work to go here an
