Electronics Forum: plating (Page 230 of 260)

Glass Plate for machine Calibration

Electronics Forum | Tue Aug 19 09:23:18 EDT 2003 | caldon

FUJI DUDE- You can purchase a Kit from IPC for verifying machine acceptability. IPC-9850 full kit with Components and boards, and such will set you back around $26,250 (member price). Just the glass board alone will cost you $3,800 (member Price).Thi

Looking for a PCB manufacturer.

Electronics Forum | Fri Dec 12 01:06:02 EST 2003 | kenny

Dear folks; I am currently looking a PCB manufacturer who can fabricate PCB with the following specification:- Board sizes: _20000__ x _20000__ mils Thickness: 125 mils PCB material: FR4 Surface finish: 30 microinches Gold over 200 micro inches Nic

Ceramic Caps

Electronics Forum | Tue Feb 24 09:52:14 EST 2004 | davef

First, two points about hole / barrel fill are: * A filled hole is an excellent indicator of the optimum process and optimum quality PCB. * The study that showed that holes need not be filled was paid for by the US Army and performed by Lockheed in

Dish Washer for BGA Cleaning

Electronics Forum | Fri Apr 09 01:41:35 EDT 2004 | Mike Konrad

Although water soluble (OA) flux is technically the easiest flux to remove, it is also the most damaging type of flux if not removed. A dishwasher lacks the pressure and nozzle design to produce the very small water particle size required for thorou

BGA rework

Electronics Forum | Mon Apr 26 09:11:04 EDT 2004 | Daniel

Thanks, We currently use Metcals for our regular work and I was looking at the ERSA system for the BGA rework. From what I have seen it seems simple to use, and since it uses IR you don�t need all the attachments for different size BGA�s. You just

Chip placement pressure check.

Electronics Forum | Thu Apr 29 10:35:31 EDT 2004 | dougt

Start with a load cell (force sensor), you will need one that can handle the force range you will be placing. Someone please correct me on this if I'm wrong but I seem to recall that placement force runs in the range of a couple hundred grams. Chec

Reference Standard for Plasma Etching or Scrubbing on Flex Ckts

Electronics Forum | Fri May 14 11:17:42 EDT 2004 | Ashok Dhawan

I am having coating adhesion problem with flex circuits. The cover plate material is KAPTON or Poly imide. The conformal coating material used is humiseal 2A64. The boards are cleaned, measuring less than 4 microgram Nacl per sq in. against acceptabl

Warming up solder paste at start of days production

Electronics Forum | Mon Jul 26 19:37:47 EDT 2004 | Grant

Hi, It was funny. The sight of 3 men standing around the microwave daring each other to push the start button, and then freaking out when the whole thing looked as though it was going to explode was funny. I guess you have to try these things! Tho

Solder pot contamination

Electronics Forum | Mon Aug 09 20:47:21 EDT 2004 | KEN

I think OA flux left on the pot would quickly looses its activity and become part of the dross waste stream, and smoke stream for that matter. Also, if your wave is setup properly your selective pallets will scour (push) the top of the lambda wav

Palladium Silver surface finish

Electronics Forum | Tue Aug 24 14:49:58 EDT 2004 | jamyboy

Hi, I am trying to assemble a LTCC component > with Pd/Ag surface finish on to Sn/Pb/Ag solder > and Sn/Ag/Cu solder. I am passing it through a > reflow. I have observed poor wettability at the > solder-pad joint. Does anyone have information


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