Electronics Forum | Thu Apr 29 17:19:59 EDT 1999 | Kevin Hussey
Hi Boys and Girls, I've been given the "task" to turn off the nitrogen in our reflow ovens. I am using the BTU, TRS series ovens, each with eight zones. Also, I have a couple of new BT Paragon ovens with 10 zones. We currently are running Qualite
Electronics Forum | Mon Jan 19 20:25:52 EST 1998 | Steve Gregory
| I have a problem! The solder on my pc boards look great comeing out | of my reflow oven. They go thrue the rest of the prossese | and at the end at the qc station it's cold or whitish or gray not shiny. | does any one have a idea on how to correct
Electronics Forum | Wed May 22 05:10:45 EDT 2002 | johnw
Ron, The new ystem is probably the best one I've seen for useability, the who thing can be driven by wizards to guide people through what they need to do. The system has the ability to set alarm's that will basically analyse your result's for you an
Electronics Forum | Thu May 18 08:31:28 EDT 2006 | marc
Hi James Short answer... yes... long answer...impingement velocity is excellent for heat transfer but it also is a higher risk of moving components. Variable speed blowers allow you to reduce the speed / impingment and more than likly your compone
Electronics Forum | Sat Apr 21 08:26:57 EDT 2007 | Cmiller
Has anyone experienced a problem with conformal coating adhesion to IS-410 boards? We are having problems with one suppliers boards. IS-410 boards from other suppliers are fine and all FR-4 boards that I have looked at are fine. We are using Conap
Electronics Forum | Thu Dec 24 08:44:25 EST 1998 | Earl Moon
| | | | Folk's, | | | | I'm in need of some help / direction. I'm working on my thesis for a masters based on looking at the effect's of the solder resist promoting / reducing the amount of solder ball's during wave. I'm looking at thing's like colou
Electronics Forum | Thu Aug 13 07:53:40 EDT 1998 | Earl Moon
| | Couple of questions. | | 1) Are we talking alumina substrates as the ceramic material? | | 2) Are we co-firing gold as the conductors on the substrate surface? | | 3) In other words, is this a hybrid thick film circuit? | | 4) If so, how large or
Electronics Forum | Wed Oct 17 13:02:41 EDT 2001 | Yngwie
We are running Clean process. solder beadings were found after the wash process. Weird eh!! It's true.. Details: 1)wash pressure ? No shadowing effects from high profile component. It also happened on the component's body of the 1210 & 0402 caps whi
Electronics Forum | Tue Mar 20 08:04:47 EDT 2018 | spoiltforchoice
Those of us doing low volume with mesh ovens and double sided boards will often use the titanium strips used for making boards more rigid for wave soldering. Gives you enough clearance for lower profile items that you would typically find on the firs
Electronics Forum | Mon Mar 25 21:50:10 EST 2002 | davef
Some of this was copped from Fred. There are numerous package types that now fall under the rubric of land grid array [LGA]. Land grid devices [ie, Bumped Chip Carrier� [BCC], LGA, Quad Flat-pack No-lead [QFN], MicroLeadFrame�, etc] are essentially
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