Electronics Forum | Mon Feb 22 12:04:15 EST 1999 | Dave F
| Please could you suggest a recommended aperture sizes for | printing of smd adhesives. Any recommendations on stencil thickness as well as stencil finish will be appreciated. | Mark: About the only rule of printing adhesives is: Keep it off the
Electronics Forum | Sun Jan 31 14:34:50 EST 1999 | Dean
| SMT Mfg. Equipment: Fuji CP-6/IP-3 - but please all hi-speed chip placer users input are appreciated !! | | The company that I work for is a C/M which offers both consignment but mostly turnkey work. I am currently running 3 Fuji lines. All parts
Electronics Forum | Mon Feb 01 17:48:36 EST 1999 | E.
| | SMT Mfg. Equipment: Fuji CP-6/IP-3 - but please all hi-speed chip placer users input are appreciated !! | | | | The company that I work for is a C/M which offers both consignment but mostly turnkey work. I am currently running 3 Fuji lines. All
Electronics Forum | Wed Aug 04 01:19:30 EDT 1999 | oscar
| | SMT Mfg. Equipment: Fuji CP-6/IP-3 - but please all hi-speed chip placer users input are appreciated !! | | | | The company that I work for is a C/M which offers both consignment but mostly turnkey work. I am currently running 3 Fuji lines. All
Electronics Forum | Thu Jan 21 19:38:24 EST 1999 | dean
| Hello, | | I will be evaluating and qualifying two equipment types. The first is a fountain soldering device. I need practical advice on all the stuff you guys and gals know about as good, bad, ugly, best applications, setup, limitations, and all
Electronics Forum | Thu Jan 21 20:22:02 EST 1999 | Earl Moon
| | Hello, | | | | I will be evaluating and qualifying two equipment types. The first is a fountain soldering device. I need practical advice on all the stuff you guys and gals know about as good, bad, ugly, best applications, setup, limitations, an
Electronics Forum | Tue Jan 19 20:47:35 EST 1999 | Steve Gregory
| Recently, someone in the SMTNET forum had installed a Wells-CTI Z-Lok socket and found that it was one row off from the board layout pads. Was the problem due to a layout error or was the datasheet incorrect? Dave ol' pal...dat wuz me...
Electronics Forum | Sat Jan 16 03:06:36 EST 1999 | Wirat S.
| | Our spec on voids is 30% ball diameter in the center. On the component to ball and pad to ball interface, we use 25%. To determine this spec, we asked around. I don't know of any studies that have been done to verify if this is OK | | | | Regard
Electronics Forum | Wed Jan 06 19:43:15 EST 1999 | Steve Gregory
Hey All you Einsteins out there!! I gotta' problem...('course you do Steve, or you wouldn't be bugging the TechNet now would you?) I had a phone call from a acquaintance of mine wanting to bring two prototype boards over to rework a BGA socket, (act
Electronics Forum | Wed Jan 06 21:17:31 EST 1999 | Dave F
| Hey All you Einsteins out there!! | | I gotta' problem...('course you do Steve, or you wouldn't be bugging the TechNet now would you?) I had a phone call from a acquaintance of mine wanting to bring two prototype boards over to rework a BGA socket
