Electronics Forum: 0.2 (Page 3 of 15)

SMT Stencil design

Electronics Forum | Thu Apr 30 23:21:52 EDT 2020 | SMTA-Davandran

I am seeing a lot of solder ball for PIP process. is it due to the paste height go beyond 0.2mm.? what is the DOE need to focused for PIP process?

FPC PAD Design

Electronics Forum | Fri Sep 11 16:28:58 EDT 2020 | majdi4

Hello, Try this one : D = 0.31 L = 0.31 A = 0.2 Stencil thickness : 100 um

versions MEdit, Fuji flexa

Electronics Forum | Wed Mar 30 12:29:55 EDT 2022 | ludo

hello, I am looking for information on new versions of Director fujiflexa and Medit. currently for Medit I am in version 18,4,0,13 and for Director fuji flexa I am in version 6,23,0,2 Is there a newer software version?

Component orientation into the reels

Electronics Forum | Sat Mar 03 09:38:13 EST 2001 | ghenning

http://global.ihs.com/industry_stds.cfm?customer_id=%21%25M%2AK%0A&shopping_cart_id=%26%258%5B%28J0%2CI%0A&country_code=CA〈_code=ENGL∨g_group=ELEC∨g_code=EIA

Visual Fail / No Pick

Electronics Forum | Tue Apr 29 03:29:01 EDT 2003 | chrissieneale

Does anyone have any figures on visual fail / no pick? our machine records this but no one has been recording the machine and it's been running since we've had it (a good few years). I am currently assuming it's about 0.2/0.3% but this is a (not very

Solder paste transfer from jar to cartridge

Electronics Forum | Tue May 11 10:58:51 EDT 2010 | davef

Paste for dispensing differs significantly from paste for printing. [B Toleno Henkel Loctite]. So, if you compare paste characteristics: Characteristic of paste||Printable ||Dispensable Viscosity [million centipoise]||0.8 to 1||0.2 to 0.4 Metal cont

QP 242

Electronics Forum | Tue Mar 29 04:15:01 EDT 2011 | ravo

Dear All, Thank you so much for your cooperation. Actually am in continous problems with my BGA and can not assemble it using my QP242 till now, I am using the following data : Vision no. : 1 Vision Type: 230 Height: 2.32 Body Size X: 27.00 +-0.

QFP footprint -extended outside pad?

Electronics Forum | Thu Sep 15 21:25:43 EDT 2011 | darby

G'day folks - haven't been around for some time but still soldering on. Question for y'all. One of my design engineers has shown me a Creative PCI audio card with a TQFP48 attached. 0.4mm pitch. Let's say the pin width is 0.2mm and the pad design ha

QFP footprint -extended outside pad?

Electronics Forum | Thu Sep 15 21:36:52 EDT 2011 | darby

I also posted this in the design section... G'day folks - haven't been around for some time but still soldering on. Question for y'all. One of my design engineers has shown me a Creative PCI audio card with a TQFP48 attached. 0.4mm pitch. Let's say

How important NSMD pads are for the QFN and similar packages?

Electronics Forum | Wed Jul 30 11:36:31 EDT 2014 | emeto

About the pads shape - you can do rectangular or oblong. For stencil design oblong is better for small pads(0.2mm) because it will give better release, so having this thought in mind you should probably design oblong shape and then print make paste a


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