Industry News | 2016-08-01 20:49:45.0
Seica will make take advantage of its debut at the annual NI Week conference in Austin (1-4 August 2016) for the world premiere of the Pilot4D V8 HF, a unique solution combining flying probe technology and High Frequency testing. Seica will also be showing another combinational test configuration, the MINI80 in a PXI rack, in booth 833 in the Main Exhibition Hall.
Industry News | 2021-10-07 15:42:42.0
Seica will be exhibiting at the SMTA International show in Minneapolis, MN on November 1-4, 2021 in booth 3432. On display will be our flagship Pilot V8, undoubtedly the most extensive flying probing test platform on the market. This system will be demonstrating full In-circuit testing as well as on-board programming, using Seica's innovative Device Clip programmer and integrated Flypod option, which ensures quick, reliable connection to any connector or programmable device on the DUT. To enhance test coverage where traditional ICT test methods may not be used, the Flypod can also provide access to the DUT for 3rd party Boundary Scan test solutions, to perform cluster tests and run BSD files. The system on display will also showcase its power up test capability, which enables many additional test techniques to be applied, such as LED testing. In addition, Seica's QuickTest software environment allows the user to easily generate and incorporate functional test routines within full ICT test programs.
Industry News | 2018-07-17 19:28:35.0
Virtual Industries features a product line of hand tools that replace tweezers or other gripping means for many applications. The PEN-VAC Kit with 8 Probes + Cups and Vacuum Pen Holder is a completely self-contained unit. There are not any batteries or hoses to get in the way.
Industry News | 2011-06-09 13:47:08.0
Cognex Corporation announces a new option to deliver its VisionView® operator interface to third-party CE Panels. VisionView CE software can now be licensed and installed directly onto Rockwell and Siemens CE panels, allowing end users to use existing equipment and reduce monitor clutter.
Industry News | 2022-07-16 08:39:50.0
SHENMAO America, Inc. is pleased to announce that the PF918-S Lead-Free BGA Sphere features the newly designed high-reliability alloy PF918 that can achieve tensile strength performance 1.4 times higher than the typical SAC305 alloy.
Industry News | 2022-08-14 14:16:58.0
Test Research, Inc. (TRI) will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 4F from September 14 - 16, 2022. Visit booth #M1034 to experience the latest in Smart Factory Semiconductor Inspection.
Industry News | 2022-10-11 17:22:18.0
SHENMAO America, Inc. has successfully developed a no-clean high thermal impact reliability solder paste. PF918-PW216 solder paste adopts the newly designed high reliability lead-free alloy (Sn/4Ag/3Bi) that achieves tensile strength performance 1.4 times higher than typical SAC305 alloys.
Industry News | 2016-08-02 15:20:43.0
Seica will make take advantage of its debut at the annual NI Week conference in Austin (1-4 August 2016) for the world premiere of the Pilot4D V8 HF, a unique solution combining flying probe technology and High Frequency testing. Seica will also be showing another combinational test configuration, the MINI80 in a PXI rack, in booth 833 in the Main Exhibition Hall.
Industry News | 2012-07-19 13:34:37.0
The Balver Zinn Group announces that Cobar Solder Products Inc. now carries the Balver Zinn Braid, a desoldering braid with a no-clean flux formulation
Industry News | 2020-11-13 17:08:31.0
Virtual Industries Inc. is pleased to announce that it is seeing increased interest in the market for its Black Plastic PRO-SERIES PEN-VAC™ Kit (V8910-BK-KIT-ESD). These vacuum pens are ideal for SMT assembly or for handling any parts that have a non-porous surface.
