Industry News | 2022-05-12 10:35:23.0
The Versatile System-in-Packages Are Based on Renesas Microprocessors RZ/G2UL with CortexA55/CortexM33 and RZ/Five with RISC-V
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2022-06-02 16:13:35.0
Vishay Intertechnology's New EP2 Wet Tantalum Capacitor offers Industry-high Capacitance, Mechanical Robustness for Military and Avionics
Industry News | 2016-10-20 05:38:17.0
The app allows you to manage traditional air conditioners that are controlled through infrared remotes. Designed for the office environment, the app relies on the ambient brightness (measured by Tibbit #28) to determine whether the aircon should be running or not. In the office setting, no lights = no people = no need for the aircon to work.
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