Electronics Forum | Thu Nov 29 22:51:18 EST 2018 | jandon
IPC J-STD-001F: 6.2.1 Solder Application: Solder shall (N1D1D3) only be applied to the one side of a PTH except for intrusive soldering. Heat may be simultaneously applied to the both sides of the PTH.
Electronics Forum | Wed Apr 03 20:23:44 EDT 2024 | lremme
I tried to clone my cfi-128 flash memory card, but can't get it to boot. I am concerned because I have no backup if the original Flash card stops working. Does anybody have a flash card with Topaz-x VIOS and (MSDOS 6.2) preloaded? I would be looking
Electronics Forum | Wed Aug 26 08:07:25 EDT 2009 | davef
Many solder wire suppliers put a on rolls of solder wire either a: * "Date of manufacture" stamp and then specify a shelf life in their product documentation ... OR * "Date of expiration." J-STD-005, 6.2, 6.3, and Table 4, where it states "If the st
Electronics Forum | Wed Apr 10 22:46:04 EDT 2002 | davef
On SMTnet, we've discussed the the frailties of controlling paste height, when volume is a more telling measure. Sometimes if you seperate too quickly, the paste tries to stay attached to the aperture walls. This creates a 'U' shaped deposit with r
Electronics Forum | Fri Oct 03 09:00:18 EDT 2003 | davef
EIA standard packages have a variety of L/W proportions. EIA||Dimension mm (LXW)||Proportion (L/W) 0201||0.6X0.3||2 0202||0.5X0.5||1 0303||0.8X0.8||1 0402||1.0X0.5||2 0504||1.25X1.0||1.25 ||1.4X1.4||1 0603||1.6X0.8||2 0805||2.0X1.25||1.6 1111||2.8X2
Electronics Forum | Thu Jan 12 10:05:13 EST 2006 | davef
There's a lots comparisons like this on the web. Here's one: Westwood Associates said on 8/12/2003: ||HASL||OSP||ENIG||Pd||Tin||Silver Flat||no||yes||yes||yes||yes||yes Solderjoint||Cu-Sn||Cu-Sn||Ni-Sn||Ni-Sn||Cu-Sn||Cu-Sn Contact||E-test, ICT||no|
Electronics Forum | Tue Nov 11 02:36:56 EST 2003 | Henry Lee
Anyone who has experience in IPC-TM-650 Environment test Method 2.6.3.1? I have a question. It is the procedure to finish electrical connections. According to 2.6.3.1D, there are apparatus which are solder pot, soldering iron and flux. Then solder a
Electronics Forum | Wed Nov 12 20:24:45 EST 2003 | Henry
Anyone who has experience in IPC-TM-650 Environment test Method 2.6.3.1? I have a question. It is the procedure to finish electrical connections. According to 2.6.3.1D, there are apparatus which are solder pot, soldering iron and flux. Then solder a
Electronics Forum | Tue Oct 31 20:42:56 EST 2000 | speedy-tech
Now we are face with tombstoning for component '0402',we have tried many ways,it seems no change,Below is our experient: 1,The thickness of stencil is 0.12mm,and the aperture is circle.the diameter is 0.55mm.The pads size is 0.5*0.6. 2 Ch
Electronics Forum | Thu May 26 06:23:46 EDT 2005 | CLampron
Good Morning EB, We too, are looking at a CAM system to accomodate these tasks. We have Unicam (Tecnomatix) 6.2 and are looking at Aegis (Circuit Cam), Valor, Sony TIMMS and Oracle. We have not made any conclusions as of yet. Unicam is strong as an
.gif)
