Electronics Forum | Tue Jun 27 16:29:28 EDT 2006 | Board House
There was a good artical on this in Assembly Magazine October 5, 2005 by Donald P. Cullen, Director of OEM and Assembly Applications, MacDermid Inc., Waterbury, CT Heres the Link http://www.assemblymag.com/CDA/Archives/56840a86f06c9010VgnVCM10000
Electronics Forum | Fri May 14 00:28:09 EDT 1999 | Mike D.
| I am seeing reflow around my signal pins after being subjected | to a profile of 204c for 1 minute and 225c for a min of 30 seconds. Signal pins are soldered into a copper plated alum. case with SB5 and then silver plated. The pins have a hot oil
Electronics Forum | Thu Jan 24 19:57:40 EST 2002 | davef
Are there formalized standards for the properties of solder balls? No Get IPC-7095 �Design & Assembly Process Implementation for BGA's�. General comments about array package solder balls are: * Ceramic packages use harder solder, like 90/10. * Pla
Electronics Forum | Tue Feb 17 04:52:13 EST 2004 | John W
There's normally a number of reasons people want to know what melts 1st, 1 - to see if you know, 2 voiding issues - whole can of worms 3 device alignment. One of our collegues has said that most balls are Eutectic, that's in fact not totally correct.
Electronics Forum | Tue Feb 14 13:16:49 EST 2006 | Carol Stirling
CRITICAL DILEMA! Has anyone run into the problem described below and if so, what was the fix (besides not dealing with this Supplier)? Also, we do not have component manufacturing process experience. We are purchasing a surge resistor that function
Electronics Forum | Wed Jan 10 17:18:11 EST 2007 | flipit
I am soldering a Germanium Window with a > metalized rim to a Ni-Au plated kovar lid. The > solder joint needs to be hermetic. I am using > 80In solder washer shape preform, but am > experiencing lots of voiding when x-rayed, > although the jo
Electronics Forum | Sun Mar 18 23:01:11 EDT 2007 | diesel_1t
Hi there, I want help on the following issue. Where I work, we place a component QFP 256 terminals (20 mil pitch)from hitachi (renesas), we use a MPM UP-3000 screen printer, IP-III placement machine and Vitronics 8 zones reflow Oven. lead plating
Electronics Forum | Tue Sep 10 08:42:26 EDT 2013 | rway
Most of our product are mixed technology. I don't consider thru-hole components as "pesky." Perhaps from a manufacturing point of view they are due to the extra handling and machine requirements. But from a reliability stand-point, thru-hole is mu
Electronics Forum | Thu Dec 22 11:18:59 EST 2022 | emanuel
I am interested to know if you solved this problem. We are experiencing something similar. The table is the first node in the CAN chain. As I see the structure, the CAN starts from the Nextmove ES card, goes first to the table driver and continues to
Electronics Forum | Tue Nov 01 15:26:43 EST 2005 | GS
Is it this your first experience of C-CGA RWK ? In order to approach a RWK of this kind of pakage it requires a capable process and clear operating procedure. In the past, the company who I use to work for, we rwkd plenty of this kind of CCGA. Earl
