Electronics Forum: a class componet type (Page 3 of 9)

Re: Intrusive reflow..from the bottom..????

Electronics Forum | Fri May 21 15:29:26 EDT 1999 | JohnW

Joe.. Sound's pretty neat trick..mind if I ask what type of comp's are on this board and the paste..? This baby (pig I think) has got a 244pin QFP right dam in the middle..!, so if ur flipin it 180 degree's are u using like a piece of Jot in line co

Through holes

Electronics Forum | Thu May 09 17:24:11 EDT 2002 | davef

First, SM-782 elates to surface mount pads. So, expecting to find PTH design rules there is a bit of a stretch. Search the fine SMTnet Archives for similar threads. For instance here�s one from last week: http://www.smtnet.com//forums/index.cfm?fu

Insufficient Heel Fillets on plastic 240 pin QFPs

Electronics Forum | Thu Mar 22 15:44:50 EST 2001 | pteerink

I have a board with QFP240 plastic package exhibiting the same characteristics. Minimum heel fillet that doesn't change with stencil mods, paste change, profile change etc ( I am working to class 2, though, so my pass spec, although they are not pret

Insufficient Heel Fillets on plastic 240 pin QFPs

Electronics Forum | Thu Mar 22 15:45:20 EST 2001 | pteerink

I have a board with QFP240 plastic package exhibiting the same characteristics. Minimum heel fillet that doesn't change with stencil mods, paste change, profile change etc ( I am working to class 2, though, so mine pass spec, although they are not pr

Solder Mask vs Solder Balls

Electronics Forum | Wed Sep 08 10:32:39 EDT 2004 | C Lampron

Good Day Everyone, I have a Class 3 medical customer where we are seeing solder balls adjacent to the fine pitch device leads post reflow. We are processing these with OA so small amounts of solder balls usually wash of at clean. These however, are

IPC-A-610D Question

Electronics Forum | Tue May 02 14:56:57 EDT 2006 | Tim

8.2.5.5 Flat Ribbon, L, and Gull Wing Leads, Maximum Heel Fillet Height (E). For class 3 the heel fillet cannot touch the body of a plastic component, except for SOICs and SOTs. Why is my question? What type of failure will be the result of solder

New equipment evaluation

Electronics Forum | Fri Nov 02 17:50:11 EDT 2012 | hegemon

Rather than a catalogue af all the machines and their specs, you might start by defining what YOUR requirements are... some machines are better suited for low mix, high throughput, some better suited for low volume, high changeover rate. Ask yoursel

Gold coated spring contacts

Electronics Forum | Wed May 30 17:49:49 EDT 2001 | davef

You are correct. IPC wants you to pay for that standard, regardless if you get a hard copy or download it. Generally, it�s pretty boring stuff for production types. [Although, you will recognize some of the goofy things your designers have done to

SPC on SMT

Electronics Forum | Tue Nov 20 12:21:02 EST 2001 | mparker

First, determine a standard to follow. IPC/EIA J-STD-001C "Requirements for Soldered Electrical and Electronic Assemblies" is most current for electronic assemblies. Second, by your customers spec. determine which class of the standard to apply. Use

Assembly Revision Control

Electronics Forum | Tue Sep 09 11:41:19 EDT 2003 | slthomas

You can always add a second level of control. We used a document that lists all configuration codes that reflected these types of changed. For instance, code 001 reflects Dwg. Rev. A, and ECO A1 and DVR 4234. Code 002 reflects Dwg. Rev. A, and ECOs


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