Electronics Forum | Thu Jul 10 09:55:47 EDT 2003 | davef
A reading of the pictures is: A1: Looks like pad [B1] is smaller than the other pads. It�s weird that the pads are such different colors. A2: Looks like pad [B1] is smaller than the other pads. Solder mask opening [B1] is misregistered and seems s
Electronics Forum | Wed Nov 01 09:01:55 EST 2000 | Thomas Ballhausen
Since your problem has been posted quite some time ago I am eager to know, if you have got any clue. One of my customers recently claimed our 313-PBGA causing problems, as one of its balls (randomly) is almost dewetting. So no evidence is found by x-
Electronics Forum | Tue Mar 19 08:18:36 EDT 2019 | sujay
ParsonAdhesive is one of the best constructors of a spacious range of high-grade anaerobic adhesives for a variety of Industrial Adhesives applications. ParsonAdhesive are provide these anaerobic adhesives and Industrial Adhesive to a spacious varie
Electronics Forum | Fri Feb 21 02:00:53 EST 2003 | successmani
Hi, I would like to know how Conductive adhesives and UV cure adhesives are dispensed. I know that nonconductive adhesives are dispensed through jetter, Auguer pump annd other contact type method. I am puzzled and curious to know whether there is any
Electronics Forum | Mon Mar 01 13:29:43 EST 1999 | dszeto
We have customer requested machine dispension on adhesive of solder side components, however we are currently using stencil printing for adhesive. Have anyone evaluated and compared on dispension and screen printing of adhesive before? Thanks!
Electronics Forum | Tue Mar 12 14:26:51 EST 2002 | cbarnett
Currently I am dispensing adhesive and would like to screen adhesive. Just need to know if anyone has had any luck with this process. If so what adhesive are you using and what are your printer parameters?
Electronics Forum | Mon Aug 19 04:48:27 EDT 2002 | surachai
I'm not found this problem with adhesive but found in NC flux , Then you should get some residue and analyse it by SEM and EDX for specify the actual source ( flux or adhesive ? ) , if it 's from adhesive , sometime your supplier must join this pro
Electronics Forum | Fri Jul 20 08:26:52 EDT 2007 | cyber_wolf
SMT adhesive is hydroscopic. Some types absorb moisture faster than others. Moisture+SMT adhesive= pourous adhesive after cure. Excessive cure ramp rates can also contribute to porosity.
Electronics Forum | Tue Nov 27 14:56:33 EST 2007 | jaimebc
Shy, What is your current method of applying adhesive? If the terminals of the component that has adhesive are not wetting ( or not forming a solder joint I think we are talking about ) after reflow, then you must be applying too much adhesive. As
Electronics Forum | Sun Jun 04 14:14:24 EDT 2000 | James.L
1) Adhesive dispensing -number of dot per component , what's the determined factor ? What's the distribution ? 2) What is the critical factor to monitor the consistacy of volume & profile per dot ? 3) What is the effect of temperature/balance of adhe
