Electronics Forum | Mon Mar 02 04:20:27 EST 2009 | emmanueldavid
Glossy/Matte & Plating). 2. Select Solder Paste according to Your Customer or In-House Specifications which is compatible for expected Process. 3. Use Chemical Etch / Electro Polished Stencil with proper Aspect Ratios (AR=>1.5) & Area Ratios(ArR=>0.6
Electronics Forum | Thu Mar 03 18:09:06 EST 2005 | gpaelmo
We also use Indium NC-SMQ92J. We do the same as mentioned per Russ. We reduce apertures mostly on QFP's with pitch of 25 mil or less (we place down to 15 mil QFP). All other apertures we keep 1:1. We print resnet 0805 size with no problems. You might
Electronics Forum | Sun Dec 02 11:06:29 EST 2012 | zero260n4
Where might I obtain this software that performs the aspect ratio for stencils, I could use Excel but why reinvent the wheel if there's something better
Electronics Forum | Wed Aug 25 15:24:07 EDT 2010 | mikesewell
Whatever you would normally use to print that size part on the pcb should work. Same aspect ratio rules apply for release.
Electronics Forum | Fri Mar 20 10:27:58 EDT 2009 | joelperez
Hello, Has anyone dealt with the process of listing the substances on their electronic products due to REACH? I'm trying to find out if there is a way to globally calculate the area ratio of all the apertures on a solder paste stencil so I can calcu
Electronics Forum | Mon Nov 13 08:24:03 EST 2000 | G. English
Richard, From your description of the IC, as Wolfgang indicates it sounds like a 20mil pitch device, the aperture design really depends upon your solder paste particle size, we use a type 3 solder paste with a mesh size of �325 / +500microns. This is
Electronics Forum | Thu Sep 06 22:49:35 EDT 2018 | cmchoue
Dear davef, All of this are takling about how to improve release solder paste, Area ratio, aspect ratio...etc, but i want to learn the "When design BGA stencil which the safe air gap between solder paste in difference stencil thickness", this can he
Electronics Forum | Sat Dec 01 13:43:51 EST 2012 | anvil1021
Do you mean the Paste Layer of the Gerber files? If so then you can check for aspect and area ratio of the component apertures (which is determined by the thickness of the stencil) there is an IPC specification for this and it is IPC-7525A I believ
Electronics Forum | Wed Jun 14 09:34:25 EDT 2017 | cyber_wolf
In my experience there is no need for wet wiping stencils. We run 0201'and micro BGA's daily with no issues. If you are having paste release issues, I would be looking at other things. Aperture area aspect ratio, aperture design, land design, sold
Electronics Forum | Mon May 24 13:11:12 EDT 2010 | deanm
A guideline that I use agrees with MikeS: For 20mil pitch, apertures should be 9-10mil with a stencil thickness of 5-6mils to achieve an acceptable aspect ratio of 1.7. Just be sure you are using a mesh Type 3 or 4 solder paste. Otherwise, larger par
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