Electronics Forum | Thu Jul 12 02:15:53 EDT 2012 | thmeier
Check also the specs / recommendations of your PCB manufacturer. We bake boards 4h/120°C before reflow and after automated cleaning (it´s not FR4!) and also if we have to rework with the autometd rework- stations (massive IR underheating ,..). Regar
Electronics Forum | Fri Dec 03 04:11:47 EST 2010 | grahamcooper22
A baking oven over 100 C will be at zero humidity. Do you really need to store pcbs/devices at 200 C...this will surely harm some products ? IPC 33B01 allows storage of MSDs in a dry cabinet at less then 5%.....these can operate at room temp or 40 /
Electronics Forum | Fri Sep 19 13:55:05 EDT 2003 | joeherz
Russ, I feel a little better now.... Baking specs...... Can you give me a tip on where to look? It's a 4 layer, .062 and roughly 5 inches square. Thanks.
Electronics Forum | Sat Mar 06 22:50:48 EST 2004 | pari
Hi, can somebody please educate 1. What is the baking temperature and time before reworking a faulty board that is received from the field. 2. What specs that specifys this baking temp and time? Thanks
Electronics Forum | Tue Jun 24 07:16:08 EDT 2003 | sanjeevc
The moisture sensetive bags that carry your BGAs will have the specs in regards to your baking cycles.But definetly you have to bake the BGAs if its been stored at 60% humidity.Normally the shop floor area should not be at such higher humidity.You ca
Electronics Forum | Tue Mar 06 10:35:37 EST 2007 | muse95
Table 4-1 only specs the humidity requirement for bake temperatures below 100C. It is conspicuously absent above that. I believe it is because moisture is in its gaseous state above 100C.
Electronics Forum | Tue Feb 20 04:18:39 EST 2001 | chinaman
Hi everyone if once the exposure time is exceeded the only option is to bake the components. I learned there is an "old spec" for the baking conditions (24h/125C or 192h/40C) and a "new spec" which is the current standard specifying conditions of 4
Electronics Forum | Mon Mar 05 17:19:38 EST 2007 | bman
I've wondered about the 5% spec myself. Section 4.2 points out that "The oven used for baking shall be vented and capable of maintaining the required temperature at less then 5% RH.", leading me to believe this spec even applies to ovens used to bak
Electronics Forum | Thu Feb 05 15:38:21 EST 2004 | mrmaint
Pete C We do bake our tray parts. I am familiar with the ipc specs. The problem is for example: a level 4 component can only be out a total of 72 hrs before rebake is required. If this is a tube or reel part, the 125c bake temp that is recommended wi
Electronics Forum | Thu May 20 18:08:57 EDT 1999 | DEON NUNGARAY
| hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... | | your help is greatly appreciated...thanks | | omat marasigan | Deon Response:|
