Industry News | 2011-05-12 21:54:44.0
MIRTEC, "The Global Leader in Inspection Technology," announces that the company was awarded the contract to provide new AOI equipment to Victron, Inc. during the recent IPC APEX EXPO, which took place in Las Vegas in April 2011.
Industry News | 2013-10-08 15:37:23.0
MIRTEC, “The Global Leader in Inspection Technology”, will exhibit its award-winning line of 3D AOI and SPI Inspection Systems in Hall A2, Stand 578 at the Productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Industry News | 2014-08-04 16:04:28.0
Mark Capizzi appointed as Equipment Marketing and Support Manager
Industry News | 2011-05-17 11:04:30.0
High Yield BGA Reballing Simplified
Industry News | 2003-03-20 09:03:05.0
Organizing a Flip Chip and BGA Packaging Technologies Workshop as a part of the SMTA Boston 2003 Conference (June 9-11) at the Bayside Convention Center in Boston, Massachusetts.
Industry News | 2014-09-12 12:59:30.0
Precision PCB Services, Inc. Announces their LIVE Interactive Broadcast Series on BGA Component Rework.
Industry News | 2015-11-19 13:29:50.0
Precision PCB Services, Inc. adds Zhuomao BGA Rework Stations to their Product Line
Industry News | 2003-04-21 09:12:57.0
June 9-11 at the Bayside Convention Center
Industry News | 2003-05-21 08:13:48.0
Two half-day workshops on Thursday during SMTA
Industry News | 2013-01-30 17:54:43.0
Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
