Electronics Forum: bga ball attach (Page 3 of 164)

bga placement w/Fuji IP2?

Electronics Forum | Tue Jul 13 00:40:44 EDT 2004 | Darren

Yes of course we are doing placement of BGA's with an IPII. However there is no front lighting so you can not inspect the balls. If the silhouette is square enough there is no problem with alignment. Just use the largest nozzle that will fit on the p

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Fri Aug 22 00:20:29 EDT 2008 | rameshr

Hai, In our process we are using the micro bga of size 13X13mm of pitch 0.45mm,after soldering process the bga found collapsed, we absorbed that the PCB land pattern of the BGA was not in array, uneven distribution of pads (area) & most of the pads

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Fri Aug 22 03:19:08 EDT 2008 | andrzej

Hi, what do you mean by collapsed ? Can you describe or send a photo ?

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Mon Aug 25 10:36:05 EDT 2008 | davef

Yes, it's peculiar that the layout of this board is so disorganized * Pads are not round, uniform, or the same size * Exposed traces have different thickness

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Wed Aug 27 00:20:38 EDT 2008 | rameshr

Dear davef, Will u pls advice what are all the possible defects caused while soldering ( assembling ) this type of boards.

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Wed Aug 27 08:25:24 EDT 2008 | davef

We'd expect to see: * Solder starved connections at pads with large trace/pad areas. * Less reliable solder connections at pads that do not match the shape and size of the corresponding pads on the component.

BGA ball crack at pad/solder ball interface

Electronics Forum | Thu Dec 07 10:10:49 EST 2006 | Learn from U

Hello, I need your advice..Welcome any input!! Cheers..

pcb design for bga grounding.

Electronics Forum | Thu Aug 12 10:49:22 EDT 1999 | Ray Hare

I am currently involved with designing a pcb which will use 225 pin bga,s The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is use the middle 6 or 7 rows of balls as the grounding,th

looking for bga rework station

Electronics Forum | Thu Apr 08 16:25:38 EDT 1999 | greg c

I am looking for a BGA rework/placement system and would like any experience that you have had. I am looking for a system that is reasonable for the placment, removing and re-balling thank you

solder ball attachment machines

Electronics Forum | Mon Nov 15 14:26:11 EST 2004 | nrocco

also the balls need to be lead free, just to make it more interesting.


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