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BGA Pad Cratering

Electronics Forum | Sat Jun 06 15:11:17 EDT 2009 | ysutariya

Was this a lead-free capable material that fits into IPC 4101/126 or /129, like an Isola 370HR? I would not be surprised because from the picture I think I can see resin underneath the lifted copper, which is an interlaminate separate. This is a

BGA cracking

Electronics Forum | Thu Sep 25 16:50:50 EDT 2008 | glennster

Ditto here, also. This is generally referred to as �cratering,� and is associated with stress on boards from operations such as ICT, installation of compliant pin connectors, and depanelization. It is more common on PCBs designed for Lead-free proc


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