Electronics Forum | Wed Dec 02 20:41:13 EST 2015 | slouis2014
Thanks for the link. Their is a white silkscreen underneath the BGA instead of a green soldermask. Attached is a picture of the BGA. Does these affect the solderability for the component.
Electronics Forum | Mon Aug 23 05:00:20 EDT 2004 | Jefflee
Hi, Would like to know if the design of the Bga pad is depth and after used solder wick and soldering iron to remove the the damage solder ball,there are still remaining solder inside the pad.Is there any method to remove the remaining solder. Thank
Electronics Forum | Mon Aug 23 21:47:49 EDT 2004 | Jefflee
Hi Terry, Thanks for the reply,but if the Bga are in big quantity like 10k and above,is there any faster method to solve this problem
Electronics Forum | Tue Jun 14 18:26:32 EDT 2005 | GS
You can find useful informations also on last review of IPC-7085 : Design and Assembly Process Implementation for BGA. Regards GS
Electronics Forum | Tue Jun 21 11:46:04 EDT 2005 | kenscj
Hi dave, Thanks for the comment. I have another issue. The board already pass Test and Burn-In processes, but after 2 months the BGA contact is found open (no contact on certain balls). How can that happen? Is it during build, the solder ball alrea
Electronics Forum | Tue Jun 14 15:18:13 EDT 2005 | jdumont
How do I send pics....sorry for the ignorance.
Electronics Forum | Tue Jun 14 20:03:06 EDT 2005 | davef
click on the email link, next to the Lou Reed icon, then paste the pix in the form
Electronics Forum | Wed Jan 27 04:01:46 EST 2016 | slouis2014
Thanks alot for the info
Electronics Forum | Fri Dec 04 05:47:57 EST 2015 | rushpcbuk
In PCB design, a BGA (Ball Grid Array) package typically determines the number of layers that a Printed Circuit Board should have. However, the 4-layer board with a BGA package is commonly used than a 2-layer than an 8-layer PCB. On the other hand, t
