Electronics Forum | Fri Dec 14 02:15:56 EST 2001 | helag
I would like to know if anyone else has experience with testing bga's with xray ? We are trying to find out what would be the best landpattern shape
Electronics Forum | Wed May 29 10:11:50 EDT 2002 | wilcoxito
Thanks for your input, Alex. I appreciate it. I'd still like some input on diamond-shaped apertures if anyone has had experience with them.
Electronics Forum | Wed May 29 10:52:56 EDT 2002 | slthomas
Just wondering why you'd use a diamond shaped aperture? Seems like it'll just fill in the corners and be pretty much round anyway, so why not just start out that way and keep the volume you want?
Electronics Forum | Fri Nov 07 11:32:36 EST 2003 | Gabriele
we experimented round pad for 0402, it improves chip self alignment and reduce tomb stone effects. On 0603, half round shape also gave guud results. G
Electronics Forum | Wed Apr 28 12:20:41 EDT 2004 | mrmaint
Paul, It is hard to tell with the bridge the shape of the shere. The balls that are not bridged look very symetrical as far as the sphere. It does not appear to be over compressed.
Electronics Forum | Mon Jun 27 21:28:15 EDT 2011 | samsim
It seems to be no solder paste release at certain stencil opening, you may need to enlarge the stencil opening. By the way what is the area ratio for the opening and how is the shape (round/square/diamond)?
Electronics Forum | Wed Apr 05 12:27:52 EDT 2017 | emeto
the package should have nozzle(midas) and camera pre-selected(hydra camera will not work(try standard or high resolution). Odd shape recognition type will not use auto teach option(try chip, leaded, BGA.... )
Electronics Forum | Tue Mar 14 05:02:35 EST 2000 | emmanuel
I am to implement PBGA, and i am looking for PCB surface finish informations. A lot of technical reports are specifing NiAu finishing because of flatness property. Because of leads shape, I though that BGA doesn't need flat pads like QFP. Is it false
Electronics Forum | Tue Mar 14 05:02:35 EST 2000 | emmanuel
I am to implement PBGA, and i am looking for PCB surface finish informations. A lot of technical reports are specifing NiAu finishing because of flatness property. Because of leads shape, I though that BGA doesn't need flat pads like QFP. Is it false
Electronics Forum | Mon Oct 21 23:48:13 EDT 2002 | harris
Hi: If anyone have the experience with the PCB pad design and stencil design for the uBGA? We meet the problem for it. The component data is 0.3mm diameter and 0.5 pitch. Could anyone tell me the PCB pad dimension, the stencil type and aperture dimes
