Electronics Forum | Mon May 12 16:31:39 EDT 2008 | tsvetan
Hi, there are different BGA packages, it's not same to rework LFBGA with 0.5 mm step and BGA with 1.27 mm step for instance basically you will be able to de-solder the BGA with hot air and proper nozzle which distributes the heat even on the BGA pa
Electronics Forum | Wed Apr 28 12:32:07 EDT 2004 | mrmaint
Paul, We are applying the paste flux to the bga. We have a plate that has a 4mil step that we squeege flat and then dip the BGA into the flux.The BGA's that we are using are new components.
Electronics Forum | Wed Apr 28 13:37:21 EDT 2004 | mrmaint
Paul, We are applying the paste flux to the bga. We have a plate that has a 4mil step that we squeege flat and then dip the BGA into the flux.The BGA's that we are using are new components.
Electronics Forum | Mon Apr 16 01:26:07 EDT 2007 | CH
Dear Sir, Thanks for your reply. From your mail, we could understnd that you are happy with Hot air rework system. Can you please advise the make and model- you are using for BGA repair . Also please advise the PACE MODEL YOU ARE REFERRING TO so t
Electronics Forum | Wed Nov 29 00:43:45 EST 2006 | callckq
Dear all, Recently, we run 2 models with heat sink attachment on top of this BGA(on top of this BGA, there is flip chip attached at the center of the BGA). Hence, the center of the BGA is higher than corner/side. We used conventional way to attach
Electronics Forum | Mon Jan 12 20:43:39 EST 2004 | Al
who has the step by step how to reball a Ceramic BGA this is a CBGA 50 mil pitch 29 by 29 mm size
Electronics Forum | Thu Dec 08 10:50:48 EST 2005 | Gary
Go to http://www.minimicrostencil.com and look up the rb-2000. There is a step by step discription of how to do it and as mentioned before you will need a thicker stencil for your application. there will me a list of stencil types at the web site t
Electronics Forum | Fri Apr 06 09:45:08 EDT 2007 | pjc
CSP= Chip Scale Package, meaning small. A MicoBGA is a CSP, while a regular BGA is not a CSP. CSPs require fewer steps to fabricate than standard BGAs. A commonly quoted definition of a CSP is a package where the body size is
Electronics Forum | Sun Sep 08 22:38:23 EDT 2019 | sssamw
what's your final verified ok stencil thickness for the QFN and BGA?
Electronics Forum | Wed Jan 16 13:31:43 EST 2008 | chef
Not a current user but have purchased several systems in the past. A major point for evaluation is: Can an older used equipment do the job and not have to buy the latest, greatest all bells and whistles machine? This depends on your applications, BG
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