Electronics Forum | Fri Aug 27 10:25:52 EDT 1999 | Matthew Park
Is it feasible to have one type of board carriers to take boards thru 1) glue curing process for first side and 2)invert carriers with boards, and 3)reflowing second side, and 4) do manual stuffing of th components and 5) take them thru selective wav
Electronics Forum | Wed Jun 14 10:12:33 EDT 2006 | Board House
Hi all, The majority of score machines used today have a top cutting wheel and bottom cutting wheel. This way they can score a line in one pass and saves on programming time, Panels are typically scored in one direction first and then the panel is r
Electronics Forum | Mon Jul 19 12:37:15 EDT 1999 | Wolfgang Busko
| | | | | Hi, SMTASSY | | | | that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. | | First, we do not do real series produktion, only prototyping up to som
Electronics Forum | Mon Jul 19 11:50:47 EDT 1999 | Mario
| | Hi, SMTASSY | | that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. | First, we do not do real series produktion, only prototyping up to sometimes 20 uni
Electronics Forum | Sat Jun 13 00:25:59 EDT 1998 | Scott McKee
Last October I purchased a Mydata over a Phillips and Amistar. I've done things on my Mydata that is impossible on the other machines. I can build the top side and the bottom side of two boards at the same time (I print both sides at once). I can "
Electronics Forum | Tue Jul 20 05:29:14 EDT 1999 | Wolfgang Busko
| | | | | | | | Hi, SMTASSY | | | | | | that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. | | | First, we do not do real series produktion, only prototypi
Electronics Forum | Mon Mar 13 14:26:45 EST 2006 | Wave Master Larry
Well, im not sure what plane you guys are on, but I can back up my what im talking about. Ya see I wnet to Soltec traingin back in 1995 for our new wave. I got a diploma proofing that I know what i'm talking about. no one else in my company has on
Electronics Forum | Fri Jun 19 10:03:46 EDT 1998 | Earl Moon
| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, We and ind
Electronics Forum | Fri Oct 01 14:16:15 EDT 1999 | Rick
I know there are a ton of variables that affect the overall height of a BGA after soldering to a PWB but... I'd like to know if anyone has done an analysis of (or if it's documented) as to what the pre and post reflow height dimension as measured fr
Electronics Forum | Tue Mar 03 02:39:56 EST 2015 | sarason
I would presume you reflow the top of the board first. Use tented vias. As you have worked out, vias have surface tension, which sucks the solder up the hole during reflow of the bottom of the board. Good luck! regards sarason
