Electronics Forum | Tue Dec 01 07:54:49 EST 1998 | kallol chakraborty
| | Hi folks , | | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Our inspec
Electronics Forum | Tue Dec 01 09:02:18 EST 1998 | Earl Moon
| | | Hi folks , | | | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Our in
Electronics Forum | Fri Dec 04 20:26:34 EST 1998 | kallol Chakraborty
| | | | Hi folks , | | | | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Ou
Electronics Forum | Fri Dec 04 20:37:45 EST 1998 | kallol chakraborty
| | | | | Hi folks , | | | | | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most
Electronics Forum | Wed Jun 13 16:51:26 EDT 2012 | davef
Sorry, but I don't have a quick and easy answer. Before jumping the 'black pad shark,' tell us more about your boards ... * Is the gold still on the pads after soldering? * Can you make the pads take solder using a soldering iron? * Does this happen
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
Electronics Forum | Tue Oct 21 21:34:56 EDT 2014 | davef
"Electroless Nickel Immersion Gold and Black Tar. What Is It and How Can It Be Prevented?" James Trainor, OM Group Electronic Chemicals, LLC SMTAI 2014 SUB2
Electronics Forum | Tue Feb 29 13:18:16 EST 2000 | Steve Schrader
We have what appears to be a recurring problem. On immersion gold boards only, we are having solderability problems. After reflow, selected parts can be popped right off the board. There is then a dark haze left on the pad. The paste on the compon
Electronics Forum | Tue Feb 29 13:18:16 EST 2000 | Steve Schrader
We have what appears to be a recurring problem. On immersion gold boards only, we are having solderability problems. After reflow, selected parts can be popped right off the board. There is then a dark haze left on the pad. The paste on the compon
Electronics Forum | Sat Nov 25 18:45:19 EST 2000 | Ashok Dhawan
I am getting black spots / stuff while I run gold finish PCB through reflow soldering process using NC solder paste.The affected spots have intermetalic as black in color. Does not solder very well. I did look at the archieve but could not find info
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