Electronics Forum | Tue Jul 11 10:13:22 EDT 2006 | SWAG
Over time, you might see problems with delam., blistering and warpage if using FR4 carriers. Depending on volumes, you might consider using durostone or some robust material like that for the production runs. Keep in mind that switching materials w
Electronics Forum | Fri Jul 28 09:20:10 EDT 2006 | pavel_murtishev
Good afternoon, No, defects aren�t trace related. I�ve just posted reflow profile (reply to Chunks). I suspect the component only. All other components are fine. But I can�t understand what exactly happens with this component. I tried to play with s
Electronics Forum | Fri Jul 28 16:36:37 EDT 2006 | chrisgriffin
Thats a great idea Doc. If we all listened to your suggestions, there would be zero defects in PCB manufacturing. I bet your using Bahodum solder which, I'm sure, is incapable of defects. Pavel, sounds like you can rule out reflow as the problem.
Electronics Forum | Sat Jul 29 09:01:08 EDT 2006 | davef
Well, a "reflothermal recipe" is a typo. It should read "reflow thermal recipe". Sorry for the confusion. Most people call this THE PROFILE. We think a profile is the output of a profiler when it portrays the result of a reflow recipe. We're gue
Electronics Forum | Tue Mar 09 12:13:27 EST 2004 | Gabriele
I want just to confirm what Dave suggested you. J-STD-033a, par 6. Boards Rework tells you plenty of useful informations. 6.1 Component removal, RWK and remount 6.1.1 Removal for Failure Analysi 6.1.2 Removal & Remount 6.2 Baking of Populated Boar
Electronics Forum | Wed Feb 21 08:06:23 EST 2007 | davef
The cause could be a lot of different things. As long as you didn't use excessive reflow temperatures, we'd guess that: * Solder mask blister: Your board fabricator should be able to demonstrate through TMA [or equivalent] analysis that the mask wa
Electronics Forum | Mon Feb 23 05:37:23 EST 2009 | emmanueldavid
Necoleta, PWB Blistering/De-lamination may not be due for Titanium finished threads / holders which is typically being used to draw high Shelf Life of Pallets and even flow across Auto Wave Soldering rails. There is also nothing to suspect on Liquid
Electronics Forum | Tue Mar 30 20:04:19 EST 2004 | Ken
If speed is truly an issue, migrate to no-clean. However, this is not always an option. Why bake after 1st smt pass? Because you are probably not drying completely under the BGA components, and/or you are pushing water into the parts/boards/ vias
Electronics Forum | Fri Aug 21 04:43:14 EDT 2009 | ghepo
Hello, I suggest you visit the website http://www.analysispcb.com, where I found these information : PARAMETERS FOR DOUBLE “V” SCORING LEAD FREE LAMINATES Typ WEB Thickness, 1.6mm : 0.38mm (+.15/-0) "...Tg is not a good indicator of a materials’
winsouce.jpg)