Industry News | 2015-01-20 23:40:52.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present two SMTA webtorials on Feb. 10 and 17. Dr. Lee's presentation, Electromigration-The Hurdle for Miniaturization and High Power Devices, discusses critical aspects regarding the electromigration of solder joints, including failure mechanisms, the effect of solder alloy composition, solder joint metallurgy and configuration, pad design and composition, current density, temperature, and current polarity.
Industry News | 2009-03-10 16:11:29.0
OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it will showcase a new, expanded range of SN100C products in booth 2564 at the upcoming APEX exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.
Industry News | 2003-04-15 08:23:22.0
Metral TINT back panel receptacles are compatible with standard pin-in-paste SMT processes, eliminating costly secondary assembly operations including heat staking, wave soldering or press fitting.
Industry News | 2008-03-20 15:46:19.0
Essemtec will display SP200-AV, a fine-pitch printer with automatic vision adjustment, in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.
Industry News | 2014-04-07 20:04:08.0
Metcal today announced that it will showcase industry-leading products in Booth #9-327 at SMT/Hybrid/Packaging, scheduled to take place May 6-8, 2014 in Nuremberg, Germany.
Industry News | 2021-10-31 04:57:58.0
Averatek is pleased to announce that VP of Manufacturing Divyakant Kadiwala will present the paper entitled, "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" during the IPC APEX EXPO Technical Conference, scheduled to take place Jan. 22-27, 2022 at the San Diego Convention Center in California. The paper was co-authored by Nazarali Merchant, Ph.D., Senior Materials Scientist for Averatek.
Industry News | 2022-01-03 07:38:59.0
Averatek is pleased to announce that VP of Manufacturing Divyakant Kadiwala will present the paper entitled, "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" during the IPC APEX EXPO Technical Conference, scheduled to take place Jan. 22-27, 2022 at the San Diego Convention Center in California. The paper was co-authored by Nazarali Merchant, Ph.D., Senior Materials Scientist for Averatek.
Industry News | 2015-04-06 16:02:12.0
Metcal today announced plans to exhibit at SMT Hybrid Packaging, scheduled to take place May 5-7, 2015 in Nuremberg Germany. The new Metcal Scarab Site Cleaning System (APR-2000-SCS) will be showcased in the SmartTec Stand 321, hall 7, along with the Solder Ball Replacement Kit and MX-HPDC dual cartridge hand-piece.
Industry News | 2013-03-18 13:30:19.0
OK International will demonstrate the new Metcal MX-5200 Soldering, Desoldering and Rework Series in Booth # 9-517 at the SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
Industry News | 2011-09-21 12:22:09.0
Nihon Superior will introduce the newest addition to its SN100C lead-free solder series, in Booth #310 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.
