Technical Library: cap (Page 3 of 10)

Soldering And Handling Recommendations For Large Size MLC Capacitors

Technical Library | 2011-04-14 15:29:39.0

Multilayer Ceramic Capacitors (MLCC) come in a broad range of sizes, geometries, and values, offering design engineers with many options for designing circuits. In many cases these MLCC’s offer advantages over other types of capacitors including low ESR/E

HolyStone International

Lead-Free Reliability - Building It Right The First Time

Technical Library | 2008-07-01 18:59:09.0

As lead-free and RoHS compliancy fast approaches, it is more important than ever to build it right the first time. Lead-free assembly and RoHS will bring about numerous changes and the number of variables with which to contend is increasing, creating increased risk of defects and reduced product reliability. However, understanding what the variables are and their impact on the assembly can great increase product reliability.

Kester

Design and Construction Affects on PWB Reliability

Technical Library | 2012-04-26 18:52:37.0

First presented at IPC Apex Expo 2012. The reliability, as tested by thermal cycling, of printed wire boards (PWB) are established by three variables; copper quality, material robustness and design. The copper quality was most influential and could be eva

PWB Interconnect Solutions Inc.

Defect freeQFN Assembly

Technical Library | 2011-06-09 20:28:30.0

QFN Description: A QFN package is a QUAD-FLAT-NO LEAD device. This package is small and lightweight and has no leads (unlike a gull wing or J-leaded device). QFN’s have a thermal pad (paddle) on the bottom side of the part that offers heat dissipation and

AccuSpec Electronics, LLC

Pad Cratering - The Invisible Threat to the Electronics Industry

Technical Library | 2012-09-06 18:19:37.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. Pad Cratering opens circuits. This occurs when the resin crack (fracture) migrates through a copper trace or via. This happens at assembly, in service or during handling. When com

Integral Technology, Inc

Wafer-Level Packaged MEMS Switch With TSV

Technical Library | 2012-02-02 19:09:53.0

A miniaturized wafer-level packaged MEMS acceleration switch with through silicon vias (TSVs) was fabricated, based on technologies suitable for harsh environment applications. The high aspect ratio TSVs were fabricated through the silicon-on-insulator (S

The Foundation for Scientific and Industrial Research - SINTEF

Impact of Assembly Cycles on Copper Wrap Plating

Technical Library | 2020-07-22 19:39:05.0

The PWB industry needs to complete reliability testing in order to define the minimum copper wrap plating thickness requirement for confirming the reliability of PTH structures. Predicting reliability must ensure that the failure mechanism is demonstrated as a wear-out failure mode because a plating wrap failure is unpredictable. The purpose of this study was to quantify the effects of various copper wrap plating thicknesses through IST testing followed by micro sectioning to determine the failure mechanism and identify the minimum copper wrap thickness required for a reliable PWB. Minimum copper wrap plating thickness has become an even a bigger concern since designers started designing HDI products with buried vias, microvias and through filled vias all in one design. PWBs go through multiple plating cycles requiring planarization after each plating cycle to keep the surface copper to a manageable thickness for etching. The companies started a project to study the relationship between Copper wrap plating thickness and via reliability. The project had two phases. This paper will present findings from both Phase 1 and Phase 2.

Firan Technology Group

A Study of Lead-Free Solder Alloys

Technical Library | 1999-05-09 14:14:51.0

With the ongoing concern regarding environmental pollutants, Iead is being targeted in the electronic assembly arena. This paper highlights lead-free solders and the different combinations of elemental makeups.

AIM Solder

Status and Outlooks of Flip Chip Technology

Technical Library | 2018-11-14 21:43:14.0

Status of flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill will be reviewed in this study. Emphasis is placed on the latest developments of these areas in the past few years. Their future trends will also be recommended. Finally, the competition on flip chip technology will be briefly mentioned.

ASM Pacific Technology

Fine Pitch Cu Pillar with Bond on Lead (BOL) Assembly Challenges for High Performance Flip Chip Package

Technical Library | 2018-01-17 22:47:02.0

Fine pitch copper (Cu) Pillar bump has been growing adoption in high performance and low-cost flip chip packages. Higher input/output (I/O) density and very fine pitch requirements are driving very small feature sizes such as small bump on a narrow pad or bond-on-lead (BOL) interconnection, while higher performance requirements are driving increased current densities, thus assembling such packages using a standard mass reflow (MR) process and maintaining its performance is a real and serious challenge. (...) In this study a comprehensive finding on the assembly challenges, package design, and reliability data will be published. Originally published in the SMTA International 2016

STATS ChipPAC Inc


cap searches for Companies, Equipment, Machines, Suppliers & Information

PCB Handling with CE

PCB Assembly Supplies - ONLINE STORE
IPC Training & Certification - Blackfox

Easily dispense fine pitch components with ±25µm positioning accuracy.
pcb cleaning

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Digital Inspection Equipment

Inspection mirrors for electronic rework and repair.