Electronics Forum | Tue Jun 11 09:35:42 EDT 2002 | mcmilse
I know this is from a long time ago but you were actually printing paste into through holes and placing? How was the paste working? Or better yet what kind of paste were you using? I work in a military enviroment and our paste is out dated(technol
Electronics Forum | Sun Apr 11 13:48:33 EDT 2021 | ngumado28898
Hi guys, I'm a newbie for SMT field. Currently, I'm facing a problem that there were many defects such as tombstone, missing, skewed, billboarding that happened with 1 type component (Resistor 0201) with a specific supplier X (we have many supplier b
Electronics Forum | Wed Jul 25 09:21:44 EDT 2001 | Stefan Witte
Dave is right that this site has several leads on 0402 placements and tombstoning issues. However, I found a new method of determining the pick position. Remove a component and fill the cavity with silly putty. After attempted pick up you should see
Electronics Forum | Tue Sep 17 12:32:36 EDT 2002 | ksfacinelli
I have an assembly that requires hand solder a part that is in very close proximity to a plastic housed PCI connector. I am using a Metcal iron and am interested if anyone has developed a shroud that will allow soldering in a tight cavity but not me
Electronics Forum | Tue Jan 13 15:16:12 EST 2004 | drewhmi
A small benchtop system uses a mask, tooled for your part, to arrange the solder spheres onto the BGA, after it has had the excess solder heat-vacuumed off and a new layer of flux applied. The spheres are poured into the cavity, excess decanted off.
Electronics Forum | Sat Aug 22 16:16:13 EDT 2015 | davef
Comments are: * Read “Challenges for Step Stencil Printing” [Carmina Lantzsch, Georg Kleemann, LaserJob GmbH] http://www.smtnet.com/library/index.cfm?fuseaction=view_article&article_id=2096 * I want to say that IPC7525B [Oct 2011] improved the dis
Electronics Forum | Tue Aug 31 07:51:28 EDT 2004 | dennispoquiz
I used to do optimization on Panasert MV2F/V,Fuji CP6/4,GSM (Universal),Sanyo TCM 3000 with no problem. My problem now is on my old Sanyo V822 SMT chipshooter. I am working on a multi-block (multi-cavity) PCB panel and i cannot, in any way, mount all
Electronics Forum | Wed Jan 12 18:00:12 EST 2000 | David J Nowak
We have a quad flatpack that is adhesively bonded to the face of the printed wiring board. We need to remove it from the board. The leads have been unsoldiered. We are thinking of placing a rectangular cavity on the end of a shaft over the QFP and
Electronics Forum | Thu Sep 11 23:50:51 EDT 2003 | Dean
Epoxy is hydroscopic. A cavity will form when the cure furnace reaches the boiling point of water. The steam expansion creates the pocket. It can be large enough to be filled with molten solder from the wave machine and cause a hard short under th
Electronics Forum | Thu Dec 29 22:19:36 EST 2005 | Joseph
We have tested SN100C for LF wave soldering process since August'05 and currently start production for a month ago. Initially we use SAC305, but due to the shrinkage cavities (micro-crack) we changeover to SN100C. In summary, SN100C did perform well
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