Electronics Forum: ceramics packages (Page 3 of 9)

Inductor damage.

Electronics Forum | Wed Dec 20 14:27:28 EST 2000 | trgroth

I am unable to find a reliable source to determine the amount of package damage allowable on an SMT coil inductor with a ceramic case. Where can I find information of this nature.

Re: Broken capacitors

Electronics Forum | Sun Dec 03 15:35:44 EST 2000 | Michael Nguyen

Wow. And I thought I was the only one having problem with ceramic capacitors.I too am having problem with cracking ceramic capacitors 1206 package.We changed vendors and still having the same problem. I had to reverify my entire process and I had to

Re: PCB washing

Electronics Forum | Sat Feb 05 21:58:08 EST 2000 | Stu Leech

I agree with all of the previous comments. 1) Here are a few things to keep in mind when cleaning with water. To effectively clean, any liquid must wet the surface. By itself, water has a surface tension of 70 dynes/square cm. This is relaively hig

CERSOT-23 solder on top of package

Electronics Forum | Tue Jul 25 13:40:04 EDT 2017 | davegoad

I have some CERSOT-23 transistor packages with castellated terminals. The 4th lead (drain castellation) is electrically connected to the top of the device by the castellation. The castellation goes up the ceramic body and contacts the metal package

Tab-Routing

Electronics Forum | Mon Feb 20 14:45:51 EST 2006 | dannyleach

Histroically we have designed our pcb panel configurations around the v-score format. The QA Dept of our company is is suggesting that we revert back to tab-routing as away to avoid damage to senistive components like large package ceramic capacitors

lid soldering problems (CQFP, Au/Sn solder)

Electronics Forum | Thu Sep 17 07:06:15 EDT 1998 | joakim fagerlund

We have problems with voids when we solder lids to ceramic flatpackages. The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel The solder is attached to the lid (preform) and the solder material is Au/S

Re: Parylene Coating of Plastic Parts

Electronics Forum | Sun Aug 08 04:36:02 EDT 1999 | Brian

Dave Frankly, I think you may be barking up the wrong tree. Like DaveF, I suggest that the process would be horrendously expensive with masking and so on. The $64,000 question is whether what you propose will serve any useful purpose. I venture to

Validation of Pick & Place programs

Electronics Forum | Fri Jan 11 10:56:34 EST 2008 | kmorris

We all know that Engineers are human and consequently may make errors when creating pick and place programs. (e.g. program a wrong part number for a given reference designator) Usually that is easy to detect since the wrong component is a differnt p

Laser trimming of resistors on PCB

Electronics Forum | Tue Jan 30 21:15:51 EST 2001 | davef

You seem to pretty far from shore to begin thinking about boats and floatation devices. Most laser trimmers are used by: * Semiconductor fabricators * Resistive component fabricators * Hybrid circuit assemblers Component fabricators and hybrid [

Re: Double Reflow (Weight/Surface Area) Ratio Rule

Electronics Forum | Tue Mar 24 17:08:52 EST 1998 | Steve Gregory

David, There was a thread going on the IPC TechNet about exactly the same thing... The ratio that was posted is: Less than, or equal to 30-grams per square inch Which means if you weighed a part and it is 30-grams, you'll need .033" of surf


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