Electronics Forum | Fri Jan 18 12:34:14 EST 2013 | duchoang
Yes, I have. think I have pretty good reflow profile. We use Lead-Free,No-Clean,SAC305 Solder Paste. The problem is at LGA design.The pad size is alot bigger than BGA. They are totally flat and do not have balls/spheres which melted and collapsed thr
Electronics Forum | Mon Nov 25 07:58:27 EST 2002 | Yannick
Hi, I made a board wich I plated with immersion Tin, I tought it should be the same result as we had with tin lead but we ran into a weird problem. WE use a 63/37 no clean paste and on the Board with Immersion Tin the solder just make a ball ON
Electronics Forum | Thu Feb 07 05:24:16 EST 2008 | muarty
I would advise that you clean the stencil thoroughly at least every 4 hours, also though it is worth cleaning the stencil top and bottom after any breaktimes. To avoid solder paste drying off in stencil apertures. Best piece of kit I've purchased was
Electronics Forum | Mon Sep 14 14:02:45 EDT 1998 | Bill Schreiber
Dear Larry, I developed the ultrasonic cleaning process for Smart Sonic. It has developed into the most widely used stencil and misprinted PCB cleaning process worldwide. With that in mind, I offer some words of caution. "IT'S NOT THE ULTRASONICS!
Electronics Forum | Wed Apr 30 07:48:37 EDT 2008 | realchunks
If your pots are open you then just need to dry them. Don't hide them. Are they rated for water clean? If not hand solder after cleaning with no-clean wire. Hand cleaning with IPA is dangerous - you really just push the flux around and don't was
Electronics Forum | Mon Sep 14 16:14:23 EDT 1998 | Jeff Sanchez
| Dear Larry, | I developed the ultrasonic cleaning process for Smart Sonic. It has developed into the most widely used stencil and misprinted PCB cleaning process worldwide. With that in mind, I offer some words of caution. "IT'S NOT THE ULTRASON
Electronics Forum | Tue Sep 24 12:58:27 EDT 2002 | dragonslayr
Although focusing on solderability may be the right answer, I wonder if you are satisfied that co-planarity is not the root cause. With random events of contact opens, this may be the case. Cleanliness of the stencil can also be a source of your pr
Electronics Forum | Tue Aug 10 15:56:30 EDT 1999 | Jason Gregory
Has anyone ever heard of this? I have a Camalot System 5000 and we were in a pinch to produce some prototype boards. We needed Sn62Pb36Ag2-no clean in a dispensing mesh. All I could get my hands on was some Interflux paste in a jar. The formulation i
Electronics Forum | Thu Aug 26 10:28:07 EDT 1999 | Stuart Adams
What are the key steps to achieving high yield with CSP ??? (We are trying qualify vendors for volume fab/assembly of some products which use several CSP devices on each side of the board. (Some with 0.5mm ball pitch)) Looking through the forum I
Electronics Forum | Mon Nov 14 10:46:48 EST 2011 | dyoungquist
Have you tried an ultrasonic water cleaning process? We use an ultrasonic cleaner with tap water and Omega Aqua Clean LPH cleaner (omegasonics.com) then rinse with DI water. However, our cleaning requirements are not as strict as yours are from the
