All kinds of ELECTRONICS trading & SMT manufacturing in both HK & China! We are sole agent of USA SMarT Sonic SMT stencil cleaning system in both HK & China! Also we rep Phoenix X Ray inspection in among PCB, PCBA, BGA, IC, SMarT Sonic AOI, Koki SMT
All kinds of ELECTRONICS trading & SMT manufacturing in both HK & China! We are sole agent of USA SMarT Sonic SMT stencil cleaning system in both HK & China! Also we rep Phoenix X Ray inspection in among PCB, PCBA, BGA, IC, SMarT Sonic AOI, Koki SMT
New Equipment | Solder Materials
8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr
New Equipment | ESD Control Supplies
Ohm-Cide® is an excellent cleaner, detergent, mildewstat against hard inanimate surfaces, fungicide against pathogenic fungi, disinfectant, sanitizer, virucide, and deodorizer. It can be used to clean floors, ESD rubber and ESD PVC mats, walls, table
New Equipment | Solder Materials
Paste flux is a combination of tackifier and fluxing agent specially formulated for touch-up soldering. BGA packages and flip chip applications. Paste flux may be applied by screen or stencil printing, pin-transfer and syringe dispensing. Four types
New Equipment | Cleaning Equipment
WORLD’S FIRST AQUEOUS CLEANER / TESTER The Aqua ROSE™, from Austin American Technology, introduces a new era to batch cleaning / Ionic Contamination Testing. Now experience a batch cleaner that offers multiple cleaning and testing technologies for c
New Equipment | Cleaning Agents
N-(n-Octyl)-2-pyrrolidone CAS: 2687-94-7 N-(n-Octyl)-2-pyrrolidone (NOP) is a faint odor, mild, and amine-like yellowish liquid. It can be used as wetting agent in printing process, co-solvent for pesticide formulation, pharmaceutical excipients
New Equipment | Solder Paste Stencils
DESEN Hito SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±18μm@,6σ Process Alignment Capability ≥2 Cpk@±8μm@,6σ Cycle Time 7s Maximum Print Area 400mm
New Equipment | Solder Paste Stencils
DESEN Navigator SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±20μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum Print Area 6
New Equipment | Rework & Repair Equipment
Full automatic BGA rework station WDS-750 xbox one controller motherboard repair machine price WDS BGA Rework Station/ BGA reballing station are widely used to replace and repair the BGA chip in laptop, mobile phone, xbox360,ps3,etc. The main use
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