Industry News | 2002-01-22 14:37:07.0
Glenbrook Technologies has announced the availability of several upgrades to their newly developed X-ray image processing software, GTI-5000. The latest version software (version 1.06) has been upgraded to run in a Windows XT, Windows 2000, or Windows NT environment and perform complex inspection routines required for leading-edge packaging technologies like TBGA's, Super BGA's, DSP's as well as CSP's and microBGA's.
Industry News | 2018-10-18 08:04:17.0
Influences of the solder material for the wave soldering machine soldering quality
Industry News | 2021-04-22 04:53:27.0
The 30th of Nepcon China 2021 was grandly opened at the Shanghai
Industry News | 2012-07-02 09:45:46.0
No has been selected as a Best of West finalist for its X-Plane™ Analysis – Sub Micron X-Ray Inspection System Option.rdson DAGE
Industry News | 2021-06-10 02:42:13.0
With the advent of 5G, especially the high integration, high density, miniaturization of packaging, and high process requirements in the electronics industry, detection efficiency is particularly important. Many manufacturers are not particularly clear about what role X-Ray can play and how to use X-Ray to improve the process and reduce the defect rate. Most manufacturers buy X-Ray because of the needs of customers. Those who are forced to buy X-Ray alone do not actually understand the important role that X-Ray can play in the production line.
Industry News | 2016-04-04 09:33:43.0
Nordson DAGE, MatriX Technologies and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit their range of market leading Test and Inspection systems in Hall 7A, Booth 329 at the forthcoming SMT/Hybrid/Packaging, scheduled to take place April 26-28, 2016 at the Messe in Nuremberg, Germany.
Industry News | 2017-10-18 20:31:57.0
YXLON International is pleased to announce that Keith Bryant, Global Direcompany of the Swiss tech holding, Comet Grouptor Electronics Sales, has been selected to present during productronica Messe München in Germany. Bryant will speak during the SMTA Technical Program in the SMT Speakers Corner (A1.220) on Thursday, Nov. 16, 2017 from 1-1:30 p.m. The presentation will look at the advantages that cross over X-ray systems, like the YXLON FF35 CT, bring to CT imaging in electronics failure analysis and in-depth fault finding. Bryant will discuss the latest technologies and show stunning reconstructions.
Technical Library | 2023-09-26 19:14:44.0
The transition from tin-lead to lead free soldering in the electronics manufacturing industry has been in progress for the past 10 years. In the interim period before lead free assemblies are uniformly accepted, mixed formulation solder joints are becoming commonplace in electronic assemblies. For example, area array components (BGA/CSP) are frequently available only with lead free Sn-Ag-Cu (SAC) solder balls. Such parts are often assembled to printed circuit boards using traditional 63Sn-37Pb solder paste. The resulting solder joints contain unusual quaternary alloys of Sn, Ag, Cu, and Pb. In addition, the alloy composition can vary across the solder joint based on the paste to ball solder volumes and the reflow profile utilized. The mechanical and physical properties of such Sn-Ag-Cu-Pb alloys have not been explored extensively in the literature. In addition, the reliability of mixed formulation solder joints is poorly understood.
Technical Library | 2012-09-13 20:45:17.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Prior to committing production boards to vapor phase soldering, we performed an evaluation to assess reliability and evaluate the vacuum soldering option. The reliability of vapor
Industry News | 2021-05-21 03:59:59.0
The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting a technical paper: 'Advantages of Prefluxed Ribbon-wire in Multi busbar Interconnection' at the SNEC 15th(2021) International Photovoltaic Power Generation and Smart Energy Conference &Exhibitiontaking placein Shanghai, China on June 2-5,2021.
