Electronics Forum | Tue May 09 16:11:22 EDT 2017 | mrk
I did look into the possibility of placing the two components side by side, but the land width on the bare board is to small to lend a sufficient solder joint for both parts. Currently I am looking at a flux coated solder preform that could be place
Electronics Forum | Fri Nov 12 12:58:38 EST 2021 | jeremy_leaf
Hi SMTnet. I have a series of sensitive parts and solder preforms which degrade when exposed to oxygen and moisture. It seems the standard way of protecting these components is to use a nitrogen purged cabinet as storage. This seems to use a lot of
Electronics Forum | Tue Feb 02 10:56:53 EST 1999 | Justin Medernach
| Would anyone have experience or information on where I could find pad geometry for tantalum capacitors that can be surface or plated thru hole mounted. | Yup, Check out IPC-782. That's got all the info on land geometries that you'd be looking f
Electronics Forum | Mon Mar 16 09:23:56 EST 1998 | Justin Medernach
| we are looking for paste printing specs.& stencils holes shapes to | perform soldering reliability d.o.e. of the a.m. | subject. | looking forward to your info. | tech. dept. /telrad prod. Call 1 800 4 INDIUM and ask for a sales person. A paper
Electronics Forum | Tue May 28 13:25:57 EDT 2002 | zanolli
Hello Anthony, The amount of solder that the process is capable of applying is the biggest limitation. I believe that solder paste is only approx. 50% metal by volume. When connectors are soldered in intrusive reflow, often the stencil is "overprint
Electronics Forum | Mon Dec 04 12:32:45 EST 2006 | russ
Made no changes to pip process for lead free. Everything stayed the same. just have to ensure that components can withstand the high reflow temp. incomplete hole fill is from aperture not being big enough. Many people forget that paste reduces in
Electronics Forum | Wed Feb 14 12:09:34 EST 2007 | rob_thomas
This was a rather intersting little project to work on due to the fact that I had such a variety of components placed in SMT ( your regular 0402 passives, ,BGA's Qfp's ,TH and SMT connectors ,plus the pesky micro BGA) I ended up with a 5/3 mil electr
Electronics Forum | Tue Jul 16 01:28:48 EDT 2002 | ppcbs
Our BGA Rework process has resulted in 100% yield. We always bake BGA chips at 125 degrees C for at least 8 hours before installation. We always bake loaded boards at 90 degrees C for at least 12 hours before BGA removal. Any parts that went throug
Electronics Forum | Fri Feb 17 09:35:00 EST 2006 | Rob
Hi, I take it you are refering to intrusive reflow? It came around as more components became available in surface mount packages leaving mainly connectors left over for a separate insertion operation & wave/selective/hand solder. Manufacturers imp
Electronics Forum | Mon Aug 28 12:44:23 EDT 2006 | actech
WE have been running a leaded product for a few years and while the product is exempt from PB free regulations the components have been comming in lead free reciently and this caused little or no change in the process and or product, However! the Boa
