Electronics Forum | Mon Aug 03 22:00:50 EDT 1998 | Dave F
| I have some potential unused SMT equipment which may be candidates for sale. Any input regarding the value or expected going rate would be appreciated. | CONDITION: | E - Excellent Condition | F - Fair Condition | G - Good Condition | Equipment Li
Electronics Forum | Mon Nov 20 04:39:19 EST 2000 | SV
Hello, I have to design a PCB for which the customer have the following temperature requirements: -55degC to +85degC operating temp. -61degC to +125degC storage temp. My question is: does the FR4 material meet this conditions? Which are the parame
Electronics Forum | Thu Aug 24 17:08:58 EDT 2000 | Dr. Ning-Cheng Lee
Depending on the stress condition experienced by the solder joints. For joints under a greater stress, the time to reach equilibrium can be shorter. Of course, the change is also more significant in phase structure. For low stress conditions, it may
Electronics Forum | Wed Aug 11 06:27:07 EDT 2021 | danisa
Hi all, The PCBA was swollen after SMD It is hard PCBA with 6 layers and SMD both sides Defect rate: ~ 5% Phenomenon: swell at the same side, same position (at 2 IC positions). Did not find any abnormality in SMD process as well as storage condition.
Electronics Forum | Thu Mar 15 03:24:48 EST 2001 | Scott B
We are currently having a conflict of opinion with our QA department regarding the very few occurences we have of chip resistors being soldered upside down (i.e. the resistive element towards the board). IPC-A-610C para 12.3.2 specifies that this co
Electronics Forum | Mon Dec 17 08:44:23 EST 2001 | davef
Maybe your lawyer can suggest a colleague that is more competent in contract law.
Electronics Forum | Thu Jun 06 09:45:14 EDT 2002 | Hussman69
We based ours on the type of paste we use (stencil life) and not so much the machine. Then we coupled that to what 'true' conditions we normally see in our plant, and determined that under these conditions Max & min) our printing process should be g
Electronics Forum | Fri Nov 22 09:51:23 EST 2002 | C Lampron
This condition could also be caused by gold plated pads.
Electronics Forum | Tue Jul 01 07:08:33 EDT 2003 | iman
suggest you check the preheat conditioning in the wavesolder process is sufficient, as this is the main culprit for micro-crack CAPs ?
Electronics Forum | Wed Sep 10 10:13:37 EDT 2003 | qp1
Dear Please the name and the conditions of this swap program Thanks
