Electronics Forum: cover problem (Page 3 of 44)

Voids problem in Lead free process

Electronics Forum | Thu Oct 05 10:37:10 EDT 2006 | David

Hello all, We have problem with voids in one of our product. We are soldering IC (package SO8) with under the components grounding connection. The ground pad for this component has 3 via holes (before producing we have to cover this 3 holes from b

Immersion Gold over Nickle de-wetting problem

Electronics Forum | Fri Mar 07 21:10:31 EST 2003 | neil

Remember the gold is only deposited to provide an air barrier so that the nickel does not oxidise. Normally the gold is absorbed into the solder joint so that the solder forms a joint with the nickle. It is not unusual to see gold remaining on pads i

Wetting problem of PCB after reflow soldering

Electronics Forum | Mon Sep 17 02:56:40 EDT 2001 | mugen

Hi, (me been absent for some time...) Are your brds confirmed HAL over copper? (check out what Dave F mentioned abt possible root causes) or are the brds HAL over nickle? (shd be no problem here, if so?) or are the brds strictly nickle plated pads?

MY19 Feeder advance problem slot 2

Electronics Forum | Wed Jun 04 00:28:27 EDT 2008 | chrispy1963

There are a couple of things that you can do. First thing to do is take a flashlight and shine it in the card edge connector of slot 2 and see if a passive component or any other part worked its way into that slot. This will cause multiple leads in

TM12 Feeder problem for MYDATA TP9-UPF

Electronics Forum | Fri Mar 20 01:04:20 EDT 2009 | padawanlinuxero

Guys I need help!!! Today I was cleaning the TM12 feeder and by accident I took out a screw that is on the side in a place that looks... well it looks like a teddy bear, I heard something falling inside of the feeder and now the screw does not thigh

Quad IVC Laser align init problem

Electronics Forum | Mon Sep 24 20:34:46 EDT 2012 | saduquette

Hi All, I have a Quad 4C that the quadalign processor started acting up on. Where the Hand Held Progrmmer would hang at "Laser Align Init" when you first turn the machine on. A couple of times I was able to get it running by pressing the re

Voids problem in Lead free process

Electronics Forum | Thu Oct 26 10:29:03 EDT 2006 | Mike

First, Voiding under thermal pad is unavoidable(pardon the pun), unless you can find a way to add sufficient amount of solder paste to cover the area, and match that solder volume on your terminal leads. I build HVM qty's of "QFN" components w/ therm

problem with a MPA-80 ( NM 2529-T )

Electronics Forum | Fri Dec 26 13:35:14 EST 2003 | fpcb

hi, When I start a MPA-80 ( NM 2529T ) I have a 4600 error, ( 1 block stop ) , I check the covers and the pressure : all ok. I monitor the head I/O address 012 and the relative bit 6 is responding when I open the covers. All seem ok BUT the error

QFN welding problem by reflux oven 10 zones

Electronics Forum | Tue Feb 11 09:26:57 EST 2020 | astarotf

Hi everyone I have problems welding QFN components in a 10-zone reflux oven, we cannot make a welding fillet that covers the entire QFN pin. Currently we use paste T4 - 63Sn / 37Pb. I enclose the curve of the oven profile. Any help or support on this

Components Sticky troubleshooting

Electronics Forum | Thu Dec 12 21:38:02 EST 2019 | peterhuang

Does anyone encounter components sticky problems? I think it should be ESD problem in cover tape.


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