Electronics Forum | Wed Oct 23 05:02:38 EDT 2002 | nifhail
Guys what is the diff. between Dye Pry test vs cross sectioning, and how is it done ? Thank you..
Electronics Forum | Thu Aug 19 10:20:27 EDT 2004 | Cal
DF-Indy: Are you thinking of a SEM as well?
Electronics Forum | Fri Aug 20 12:29:43 EDT 2004 | df_indy
Thanks for the input. We currently do not have plan for SEM.
Electronics Forum | Tue Oct 24 11:00:56 EDT 2006 | SWAG
I'm not sure why that was done. They based that decision on what they saw in cross-sectional analysis of the failures.
Electronics Forum | Tue May 06 23:16:20 EDT 2008 | hhorse
Could you tell me how to detect PCB delamination issue? through cross section, SAM or others?
Electronics Forum | Tue Mar 04 06:33:38 EST 2008 | reypal
The attached photo from cross section. (like head in pillow)
Electronics Forum | Fri Apr 25 07:15:50 EDT 2008 | davef
Please post a picture of your cross section.
Electronics Forum | Mon Feb 08 09:03:49 EST 2010 | woodsmt
Looking for methods for detecting BGA microcracks without cross sectioning. Currently evaluating a new package and will be putting together a thermal stress eval. We would like to perform intermediate inspections for cracks. Once all cycles are don
Electronics Forum | Wed Aug 07 15:58:17 EDT 2024 | SMTA-64386252
Hello. Since a DFN is a BTC component, an end fillet height is not required on IPC 610 since most of these components did not have a wettable surface on the sides. A cross section in a non-touched up sample could be performed to validate the solder
Electronics Forum | Wed Aug 18 21:04:45 EDT 2004 | davef
Sectioning equipment suppliers: Leco, Struers, Buehler General automatic and manual sectioning methods: IPC-TM-650 2.1.1 and 2.1.1.2
