Electronics Forum: dams (Page 3 of 9)

SPC on SMT

Electronics Forum | Wed Nov 21 05:21:39 EST 2001 | frha

Thanks Dave! I agree 100% with you and try not to deceive myself! It is very dangerus to let it be a dam paperwork of must. Good id� to change focus frpm process to product-characteristics!! I will see the benefits and cost savings as well as the t

Epoxy Covered PCBAs Means to prevent hacking?

Electronics Forum | Mon Sep 22 22:19:16 EDT 2003 | Dean

Questions: 1. Is this a retail product sold as PCB only? Or is this in a finished chassis / case (like an external modem)? 2. Are the customers damaging only the BGA devices? Like prying them up with a screw driver? What? You can dam and fill

Help with dewetting

Electronics Forum | Tue May 25 13:03:35 EDT 2010 | jdumont

Hello, I have no experience with CE-1155 but a ton with 1B73. I would say Justin hit it right on the head. 1B73 does not like to be anywhere near silicone residues. We make sure the boards are handled with gloves after wash, before coat. Unfortunat

Bigger particle size solder paste helps reduce via hole problem?

Electronics Forum | Wed Jun 01 15:50:59 EDT 2011 | markhoch

I don't believe that particle size of the solderpaste will offer you any relief from this issue. The solder flows into the via, leeching away from the desired solderpoint, after the solder has become liquious. The chemical make-up of the solder contr

Re: Soldermask Design Rules

Electronics Forum | Tue Jun 13 21:57:01 EDT 2000 | Dave F

Todd: You say: "... solder masking between the lands of fine pitch components can cause stenciling problems and or manufacturing problems." I say: Fine pitch components without solder masking between the lands can cause stenciling problems and o

bridging between 2 pads

Electronics Forum | Wed Nov 07 11:56:44 EST 2001 | mparker

Pad spacing is just one element to consider. Your pad spacing is determined by the pitch (center to center distance between the leads). There are several good resources to find the appropriate pitch per device. Search the archives here or refer to th

BGA attach eval.

Electronics Forum | Tue Apr 01 09:58:52 EST 2003 | davef

You're entirely correct. The gold is most likely gone away. [Don't forget you can check if the surface is still solderable with a hand soldering iron.] We're not sure it it will give you the results you seek, but consider using a dye penetrant fai

pad skipping after HASL

Electronics Forum | Sun Oct 01 23:58:55 EDT 2000 | stuartfd

Dear forum types, 1st timer so be good. I have a customer in China using Coates soldermask that in its self is not a problem. The problem is the flux their using, I think,it appears to have a vary high viscosity. The problem they have laid at my door

BGA Solder Mask Repair

Electronics Forum | Thu Feb 22 20:53:44 EST 2001 | davef

You're not sposed to pull the mask from the BGA when reworking it!!!! ;-) Well, if you insist. You can be as fancy as you want. Basically, all you need to do form a dam to prevent the solder from flowing from the pad to the via and starving the

Re: Shorts on BGA

Electronics Forum | Mon Mar 15 09:55:53 EST 1999 | Justin Medernach

| After rmoving a BGA (plastic)to correct unexplained shorts | I installed another BGA using flux only. | Checking on an X Ray machine and found two shorts. | | can anyone give a good explenation ? | | Thanks | | Ron | Ron, It could be a number o


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