Electronics Forum | Tue Jan 27 02:00:40 EST 2009 | sachu_70
Your image does not clearly explain the problem. However, I can see a good heel fillet formation at the joint. In general, TSOP leads are delicate and should handled with immense caution and good ESD protection. First let us be clear that any "rework
Electronics Forum | Wed Jun 06 02:57:37 EDT 2001 | kyaw
I have a problem run in Burn-in-Board that the sockets lead are deform and lifted about 6 mil to 10 mil from PCBA. Anybody can inform to me for this problem. Thank you
Electronics Forum | Thu Apr 24 09:03:19 EDT 2003 | jgregory
Thanks Dave, great info! I will be looking into your recommendations. Our AmeriVacs unit is lacking in the robust design department as far as I'm concerned. I don't like the pliable rubber sealers. They deform too much. Jason Gregory
Electronics Forum | Thu Apr 24 09:27:56 EDT 2003 | jgregory
What I meant is the gray rubber seals, top and bottom, that are pliable to allow the SS nozzle to slip back out and still provide sealing, deform too much and "squish" out to the sides. Jason
Electronics Forum | Tue Jan 11 17:19:15 EST 2005 | vickt
Clark, Which component type are you using? Deform? also, is this a domed led? and if so, are you using a nozzle with an approriate ID to seal on the body? Not every LED may be able to be placed with a 4791. Todd
Electronics Forum | Wed May 02 06:56:52 EDT 2007 | Rob
Has anyone experienced deformed balls on BGAs - especially very low volume build to order devices? I'm looking into a possible hidden pillow defect and think I have eliminated most of the other factors I believe could cause it. Cheers, Rob.
Electronics Forum | Mon Jan 26 11:18:10 EST 2009 | evtimov
It seems like your parts are acceptable regarding IPC610. I would't bother if all in the specs. But the question is why you damage your partss in P&P process. I think you should avoid that instead of looking for standards. Regards, Emil
Electronics Forum | Thu Jan 21 03:09:05 EST 2010 | aungthura
I have tried to solder sockets by reflow machine. but, failed because sockets were deformed after reflow.Has anyone had some advise for me?
Electronics Forum | Sun Mar 21 08:09:40 EDT 2010 | itzikbs
During PCB bare board inspection we found some deformation on the PCB surface. I appriciate any comment, whom can explain if the boards are problematic or not and whay may casue this phenomena
Electronics Forum | Sun May 16 20:47:25 EDT 2010 | aungthura
Thanks Dave I tried various sockts but all were failed.At SnPb profile,maximum- 230'c~240'c, the solder at sockets' pins not melted.Increasing to 250'C, the sockts were deformed.
