Electronics Forum | Mon Sep 29 14:47:07 EDT 2008 | ikonify
Have seen similar problem before with regards the MSD being the cause. But also seen similar defects being found at functional test as the in-circuit test was injecting to much current during test. The devices were walking wounded afterwards. The in
Electronics Forum | Wed Dec 15 19:31:26 EST 2004 | Thomas Denison
We have a ceramic BGA that the component supplier has misaligned the spheres in the fixture so they slant .007" out of alignment from the substrate pads. When the devices are tested at the component manufacturer this alignment issue also causes the
Electronics Forum | Thu Sep 10 10:04:27 EDT 2015 | emeto
1. Automated optical inspection(this is a machine that checks for you using camera and software algorithms for recognition) 2. Electrical test. For any PCB a test device can be made. A standard one will look like this: Put the board in the device. Go
Electronics Forum | Thu May 06 11:37:48 EDT 2010 | davef
There is no specification. Shear tests are very material / operator dependent. BALL SHEAR TESTING OF RAW BGA DEVICES: A total of 3 devices were subjected to ball shear testing. Results of the testing indicated shear values in the range of 0.7-1.25
Electronics Forum | Thu Aug 13 19:30:57 EDT 2009 | secura1
I'm new to all this... we have a board with one BGA blue tooth device. one test for the board is an rf test that measure successful packet transmission. we find that we get much lower error rates if we "reflow" the BGA with a heatgun. We do this
Electronics Forum | Mon Jun 17 09:52:33 EDT 2013 | sara_pcb
My circuit board contains 11 x 11 matrix 1mm pitch BGA, The device was tested in socket on evaluation Board. We handed over the actual PCB & devices for re-flow. The assembly house first re-flowed all the SMT components other than BGA. BGA was placed
Electronics Forum | Fri Dec 16 07:42:05 EST 2005 | pavel_murtishev
Good evening, We noted one more very strange problem with flash memory chips. Device fails test due to flash chip malfunction. From the first sight open joint or cold joint can cause such problem. But all chip legs are soldered well. We just heat th
Electronics Forum | Wed Nov 26 07:45:24 EST 2008 | davef
Investigation of Device Damage Due to Electrical Testing, R Croughwell & J McNeill, Worcester Polytechnic Institute Abstract: This paper examines the potential failure mechanisms that can damage modern low voltage CMOS devices and their relationship
Electronics Forum | Thu Aug 05 21:47:35 EDT 2004 | KEN
Agreed. Joint failure can happen when un-bagging or durig box-build (at customer site). Careful handling should be used. In one case I had boards returned to me for evaluation and failure analysis. Too bad our site never built the boards!!! (jacka
Electronics Forum | Tue Aug 25 10:38:03 EDT 2009 | grahamcooper22
Hi Sergey, Do you know the Moisture Sensitivity Level of the component ? This is normally recorded on the DRY PACK that the device comes in. It is not unusual for a device to POP CORN and still work in test. It depends how much damage there is to th
