Electronics Forum | Thu Sep 24 18:57:03 EDT 2009 | davef
From "siliconfareast.com": Basic Die Cracking FA Flow 1) Failure Information/Device and Lot History Review. Understand the customer's description of the failure, i.e., the failure mode, where it was encountered, what conditions the sample was subject
Electronics Forum | Tue Oct 30 22:08:45 EST 2001 | flynhi34
I have not looked into eutectic die attach. My dies are about .012" square and could get smaller. Currently using a Epoxytech conductive adhesive. I am going to go out and look at equipment and build samples. Some vendores state they can do .010"
Electronics Forum | Fri Jul 23 09:01:36 EDT 1999 | Earl Moon
| HI Earl | Thank you for your answer. | Let me know you about the hot you mentioned | First of all, The rework machine is the BGA3500 (manufactured by 0.k international:U.S.A) | ��DESOLDERING HEAT :OVER 200��(CENTIGRADE),30SEC(CHECKED
Electronics Forum | Wed Oct 02 12:06:59 EDT 2002 | dragonslayr
Scott - all sounds good. My primary concern is the residual flux left behind under the BGA. Will moisture entrapment become a concern over time? I believe that may be dependent on the flux formulation. I know that some no clean fluxes actually become
Electronics Forum | Thu Jan 02 21:54:18 EST 2003 | jonfox
This should be a fun one! I was asked the question from our Engineering, should we use die attach with wire bond or go ahead into the new world of flip chips? Right now, I am faced with information overload about the two processes but I am really l
Electronics Forum | Wed Jul 20 08:40:27 EDT 2011 | mosborne1
Umar - This is usually seen when the lead frame in the die attach is cut with a diamond saw instead of a lasar. We have seen this problem years ago from HP 7 segment displays. If you have Enviromental box (tenney box) you can temp cycle them from 0 d
Electronics Forum | Tue Oct 30 17:16:24 EST 2001 | seand
Hello Chris, If you could humor me, what are the limiting factors forcing your dot size to .010"? What is the die size that you are placing? What are the accuracy tolerances? Was eutectic die attach never an option for this bare die? Have you de
Electronics Forum | Thu Oct 11 13:37:35 EDT 2001 | Stefan
The pressure sensitive tape is used as an alternative to heat sealed cover tape. It works usually quite well and is easily applied by the taping machine, but it can create some problems in the tape feeder. In the Surftape, Cal is referring to, the c
Electronics Forum | Wed Sep 18 22:53:24 EDT 2002 | davef
Please give us background on your situation, so that we can focus on the specifics, for instance: * This is a bare board problem, correct? Then, this contamination causes what the problems in your process? * What is the type [ie, FR4, CEM1, etc] of
Electronics Forum | Fri Nov 27 08:07:50 EST 1998 | Earl Moon
| | | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is
winsouce.jpg)