Electronics Forum | Fri Feb 05 21:34:25 EST 1999 | Raymond Bellamy
I am looking for a piece of equipement that can safely remove silicon die(200mil by 200mils) from a LTCC board. My present method involves a dental drill which often goes through the dielectric layers and causes scrap.
Electronics Forum | Thu Dec 27 02:57:49 EST 2007 | gersla
17 mm x 17 mm or any stacked die package). What is stacked die package? Can you send me a picture of such a component? Thank you in advance,
Electronics Forum | Mon May 04 11:09:07 EDT 2009 | billa
Larsen Mfg. in Mundelein, IL makes depaneling presses and dies. The press and dies are similar to the Wand Tool process. Contact Bill Anderson at 847-970-9600.
Electronics Forum | Sat May 16 13:18:09 EDT 2009 | pioneerdietecs
Pioneer-Dietecs Corporation manufactures depaneling dies and singulation systems. The dies can be used in a Wand press. Visit http://www.pioneerdietecs.com or send a CAD file, PDF or picture file to larson@pioneerdietecs.com.
Electronics Forum | Mon Jul 04 20:10:05 EDT 2011 | rickysanchez
1.The bubbles appear only after the oven curing.before curing no bubbles encounterred. 2.The bubbles were very small, and can be found around the die in between the die and the epoxy. 3.Curing time is 150 degC for 4 hours.
Electronics Forum | Mon Dec 03 15:46:16 EST 2012 | bmario
Hi, Recently we have found a chip on a card having very small damage on the die corner. I would like to know if there are some industry standard criteria of acceptance available. If not, what would you recommend?
Electronics Forum | Wed Jul 15 08:36:41 EDT 2020 | dproldan
Using a X-Rays machine, we have noticed that one component we are using has the silicon die bonded at an angle in the package. Have you ever seen something like this? I'm not sure if it's intentional or a manufacturing error.
Electronics Forum | Wed May 10 17:57:36 EDT 2023 | leviwhite
Bevor ich mit dem Spielen anfangen, komme ich wieder zu einem Beitrag, in dem die neuesten Nachrichten über die Casinowelt vorgestellt sind. Das hilft mir, richtige Entscheidung zu treffen.
Electronics Forum | Tue Jan 09 22:04:48 EST 2007 | Guest
Set Up Guy, I am not sure if the COB you are refering to means Circuit on Board . If yes, this process also include SMT . Package is a combination of some passive components and bare die. Passives are normally attached thru SMT using solder te
Electronics Forum | Mon Sep 19 19:22:11 EDT 2011 | henrytcx89
Thanks for taking ur time to answer this. =) The pick and place machine is just pick from wafer(on tape) and place into waffle pack. I read from some of the sources saying that the ejecting needle and the vacuum pick up bits could cause the die to c
