Electronics Forum | Thu Jun 21 14:43:37 EDT 2001 | Ian T
for the application we hae to do, we can't print paste. we can however dispence paste. what are the advantages and disadvantages? is there any equipment you would recomend? thx for the help
Electronics Forum | Tue Mar 08 17:59:04 EST 2016 | warwolf
Thank you!, Sent them an email.
Electronics Forum | Mon Feb 26 14:15:21 EST 2001 | marting
Steve, Currently we are using selective pallets and the best piece of advice is to find a supplier that will be able to handle the requirements of the selective wave process, for example proximity of chips to PIH devices, and pallet thickness etc. We
Electronics Forum | Fri Jul 28 11:12:18 EDT 2023 | shrikant_borkar
Hi SimionR, Is Glue Process Dispencing or Glue Printing thru Stencil? if Its Dispencing Glue thru a Nozzle then its a controllable process. I have performed it thru HDP-3 Panasonic. Placement of Glue either one DOT or Process must be aligned with th
Electronics Forum | Thu Jul 20 15:01:25 EDT 2000 | Bob Willis
Yes I have done this at a company. The components were automatically inserted as well. The process was screen print palce SMT reflow dispence paste Flip board insert through hole Reflow I wish we could show photos on this page and I would show you
Electronics Forum | Thu Jun 21 15:52:37 EDT 2001 | ohboy
Hi Ian- check out the ipc.org technet forum archives, there was recently a big thread about this very subject. There are some definite advantages in some situations to dispensing paste. Bill
Electronics Forum | Thu Sep 06 16:14:39 EDT 2001 | Ian T
does anyone know of any valve purge compounds other than efd sloderplus 6-460? we are getting a dispence system and think this type of compound could help
Electronics Forum | Mon Apr 29 03:01:53 EDT 2002 | Bob Willis
Had a similar problem recently where there were scatered balls and voids in joints and on the surface of the joints. The paste was dispenced from a cartridge with no kneeding or mixing before printing. The result was spitting and voids. Mixed the pa
Electronics Forum | Tue Mar 01 03:25:33 EST 2005 | bing
We are using a GDM with a linear piston pump fitted to dispence adhesive on 0603's. Use Universal part number 43273801 needle with a 42346504 piston. The single needle dimentions are 0.010 ID, 0.028 OD, 0.005 stand off
Electronics Forum | Thu Sep 28 08:20:08 EDT 2006 | Brian
Stick with what you already know. A GSM1 with a 4 spindle head is the way to go. Its excellent for balancing a line becuase you can place anything with it. Or if you need to dispence glue or odd form parts you can add another head later.
