Full Site - : dreamsniper (Page 3 of 6)

Re: Fine Pitch 48-pin TSOP

Electronics Forum | Fri Dec 01 00:37:20 EST 2000 | arminski...aka..Dreamsniper

I have a proto-type PCB with a 48-Pin Fine Pitch TSOP (0.5mm pitch) with a dimension of 19mm L x 11.50mm W x 1.10 Thickness. They are at the bottomside of the PCB and I need to wave solder the board. There are 8 of them at the bottom side. Are they o

Re: How to convince management on buying Equipment ? ---For Dave F, Wolfgang, Moonman and the rests!!!

Electronics Forum | Wed Sep 27 13:45:35 EDT 2000 | Bill Schreiber

Dear Dreamsniper, A big hidden cost in any cleaning system is the cost of diminished production and rework. I assume you are cleaning the adhesive stencils manually since there is no equipment cost in your formula. Manual cleaning of adhesive sten

Re: Decommissioning or Scrapping PTH/SMT equipment

Electronics Forum | Thu Apr 06 10:10:43 EDT 2000 | Jon Wentz

Dreamsniper, Always remember your ace in the hole when it comes to equipment used in this industry; its complexity! CPK, PPK and various other cost studies are excellent ways to "communicate" to bean counters your situation with the particular mach

Fine Pitch Pad Width Size VS Component Lead Width

Electronics Forum | Wed Apr 11 06:06:53 EDT 2001 | wbu

Hi Dreamsniper, the IPC land design standard is IMO a good reference. If you use the online calculator you can influence the result by varying for example manufactoring parameters. For the same lead width and same tolerances (and of course pitch) we

Re: PCB Component Legend Under SMT Pad/Land

Electronics Forum | Mon Sep 13 04:17:10 EDT 1999 | Earl Moon

| I noticed that some of our pcb's component legend/designation are unreadable as they are placed under smt pads. Is this correct and according to standard? Although we don't have any problems with them as of now, I would like to know the effects on

Re: Solder Paste Stencil Reference Material

Electronics Forum | Sun Aug 22 06:34:40 EDT 1999 | dreamsniper

| | Has anybody run across a good concise book or other source on solder paste, its characteristics, handling, storage, stencil design, printing and reflow? Yes I asking for the world! | | | | TX | | Mark | | | As the world turns, or is/was that a

Re: no clean rework

Electronics Forum | Tue Aug 10 05:51:03 EDT 1999 | Gian.D

| | hello to everybody, | | we have a really satisfactory no clean process, both smt/reflow and wave soldering, but we get troubles with defects rework; | | does anybody know how to eliminate flux residues or how not to produce them during rework op

component shelf life

Electronics Forum | Thu Aug 29 18:28:19 EDT 2002 | Dreamsniper

Semi conductor devices last for 5-10 years or more when in use. Since those parts are in stock and are not in use they are considered in good condition. The only concern that you got is how will you process them. We had the same problem before and it

Water Soluble for No Clean BGA Balls

Electronics Forum | Tue Apr 13 21:33:48 EDT 2004 | qualitel

Hi Dreamsniper, It seen this is the major issue had been occurs you.( We had face all this issue last time too) We had done a lot of areospace products before and most of ours products is a must on class 3 spec. BGA is not that tough t

Re: Adhesive Dispenser Vs. Screen Printing Adhesives Pros and Cons

Electronics Forum | Tue Oct 03 20:35:23 EDT 2000 | Dave F

1. Throughput * Dispenser: Slower, may loose 70% of tact on fast chip shooters * Printer: Can be put in front of and use fast chip shooters effectively 2. Rework Rate ???? Deposition control???? * Dispenser - High control over amount paste - Coplan


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