Technical Library | 2023-09-16 06:31:54.0
Discover our specialized reflow oven tailored for efficient soldering in 5G modular and radiator assembly. Achieve precise and reliable connections for high-performance electronics.
Technical Library | 2013-09-25 20:57:24.0
Conformal coating is an enabling process that allows for the ruggedizing of electronic devices and modules. As the process increases the durability of electronics that are subjected to various end-use environmental conditions, it adds value to the product. While it does add value, consumers and manufacturers expect the electronics to work when subjected to dirt, humidity, moisture, corrosive materials, and various other contaminants. This expectation results in a drive to minimize the cost of the process. The lowest cost of ownership for a conformal coating process occurs by utilizing automated selective conformal coating equipment.
Technical Library | 2019-05-31 14:21:59.0
Microelectronics is the manufacture of systems built from extremely small electronic components. In today’s electronic world, devices must be portable, equipped with wireless technology and are driven by size, weight, power, and cost (SWaP-C). These system level drivers are crucial to all current and future electronic applications from personal computers and cellular telephones to military-fielded hardware, biomedical instrumentation, and space-flight hardware.
Technical Library | 2019-06-05 11:11:06.0
As electronic products increase in functionality and complexity, there is an emphasis on affordability, miniaturization, and energy efficiency. The telecommunications, automotive, and commercial electronic markets are the leading drivers for these trends. These markets see high volume manufacturing with millions of units priced to the fraction of the cent. The choice of the packaging material for the electrical components for these markets can have a substantial effect on the cost of the final product. Therefore plastic encapsulated components are almost universally used in non-military applications over the conventional ceramic or metal electronic packages.
Technical Library | 2019-05-30 11:04:03.0
There exists a need to efficiently remove heat from power electronics within power systems to enhance performance. Thermal management is a critical function to that operation. Reducing the junction temperature of semiconductor power electronic devices enables them to operate at higher currents. Lowering operating temperatures reduces the thermal stress on electronic devices, which improves efficiency and reduces failures. To improve the heat removal process, the current heat transfer design of a power system has been analyzed and a variety of thermal interface materials (TIMs) and cold plate technologies have been evaluated. This paper will review some of these results.
Technical Library | 2019-07-19 10:21:14.0
One of the most frequently asked questions of ACI Technologies (ACI) is how to qualify and verify that the electronic systems shipped by their respective companies are Restriction of Hazardous Substances (RoHS) compliant. The RoHS directive has been implemented since July of 2006, and the preoccupation with what constitutes a compliant product continues to confuse the electronic industry. ACI receives countless inquiries regarding how to qualify and verify that the electronic systems shipped by the irrespective companies are RoHS compliant. The approach to proving compliancy requires a sequential analytical process that utilizes a decision flow chart.
Technical Library | 2019-10-16 10:20:25.0
A major goal of the development of advanced packaging technology is to reduce the size, weight, and power consumption of electronics components using state-of-the-art commercial technologies. One of the novel concepts involves the use of all three spatial dimensions when designing and producing new systems. In the past, electronic structures tended to be two dimensional in nature. Generally speaking, individually packaged integrated circuit (IC) dies were interconnected on printed circuit boards. Techniques such as die and package stacking naturally contribute to a reduction of the spatial footprint of any given electronic system design.
Technical Library | 2020-01-13 09:48:06.0
Is it possible to coat electronic assemblies with a thin, uniform in thickness, pinhole-free, moisture impervious, truly hermetic (by the MIL-STD-883 definition) film of ceramic material that is far more affordable than placing the same electronic assemblies in the currently used glass-to-metal sealed, thick, heavy, metal-and-ceramic-based hermetic enclosures? Since the coating (called a “conformal coating”) would be both hermetic (moisture proof) and hundreds or thousands of times thinner than the currently used enclosures, it would be both less expensive, lighter, and still just as effective in excluding moisture (hermetic) as the current heavy, bulky, expensive electronic enclosures are.
Technical Library | 2019-05-29 10:42:23.0
Battery selection should be considered early during the design phase of affordable electronic systems. The important choice of an appropriate battery can reduce system acquisition costs and keep logistics support costs down for the life of the system.
Technical Library | 2023-09-15 09:47:24.0
Explore our PCBA Coating Line introduction to safeguard your electronics. Discover the best coatings for PCBAs to protect against environmental factors and ensure long-lasting reliability.
