Electronics Forum | Thu Mar 30 13:15:17 EST 2006 | gregp
Maybe the issue is how the feeders are being unloaded. The operators should leave enough covertape to reload the reel onto a feeder without component waste. If the issue is some parts are exposed in the feeder then you will most likely loose those p
Electronics Forum | Wed Nov 17 10:03:29 EST 2010 | scottp
Instead of a minimum thickness, we require no exposed copper or SnCu intermetallic. We've been having a lot of trouble lately with suppliers of SN100 HASL boards giving us pads with very irregular solder deposits with areas of exposed intermetallic.
Electronics Forum | Wed Dec 14 17:25:58 EST 2011 | blnorman
Not really sure I understand. Are you trying to install MSL controls in the plant? If so, do you mean from the standpoint of say a MSL 5 part that has been exposed to the mfg floor for 24 hours then returned to the cabinet: how do you collect the i
Electronics Forum | Tue Oct 09 14:30:32 EDT 2012 | bandjwet
Put on your Chemical Thinking Caps..... We are ablating the mask of a PCB which was over a copper layer. This exposes copper. Outside of an electrical test (no can do) how could we use a fast non-destructive test in order to determine that copper (
Electronics Forum | Fri May 13 17:28:43 EDT 2016 | dyoungquist
Depends a little on how long it was exposed to the wet environment as moisture absorption by electrical components is a very slow process. That said, MSL 1 rated components can be exposed to high humidity indefinitely and still not need to be baked.
Electronics Forum | Fri Feb 03 16:40:24 EST 2006 | Mike
At my last employer, we ran a number of tests to make a "Hybrid" profile work (same profile Joe lists) . It worked great for everything but BGAs. The problem (6 months ago) was using parts not rated for lead free reflow temps. As the market fills wit
Electronics Forum | Tue Jan 12 08:06:43 EST 2010 | kpm135
basically the rule of thumb for the 8mm feeder is that you only want one component exposed in the pocket at a time. If you see more than one component exposed you need to go down in size. The reason for this is that if there is another component expo
Electronics Forum | Tue Dec 14 12:00:34 EST 1999 | Kris Wiederhold
We recently reduced our standard aperture reduction to aid in the reduction of solder on gold defects. Since this reduction in aperture size, we have been experiencing exposed copper at the end of the component pads. The heel and toe joints are per
Electronics Forum | Thu Jan 08 14:33:50 EST 2004 | dwzeek
Toe fillets are not required per IPC. Toe fillets could be used as a process indicator, if you desire; I would not. Gull wing leads are typically cut off on the ends when manufactured; this exposes the non-plated material in the lead, typically coppe
Electronics Forum | Tue May 06 15:33:36 EDT 2008 | operator
I know IPC-A-610 RevD has requirements for Gold Fingers and solder contamination. Is there any such requirements for Gold Mounting Holes, Gold Pressure Fit Socket Lands (SMT pads), Exposed Gold Traces ? Wouldn't these all be considered "critical cont
