Electronics Forum | Wed Feb 04 06:26:20 EST 2009 | sachu_70
Hi Peter, The defect you observe during the second side reflow could be caused due to improper Au plating thickness in the PCB fabrication process. You can refer IPC-2221 wherein plating thicknes for ENIG mentions 0.08um to 0.23um for Immersion Gold,
Electronics Forum | Tue Jan 20 17:51:24 EST 2009 | davef
We'd guess that since your board fabricator could not remove this stuff with it's HAL-leaded process, you're unlikely to remove it with your soldering process that is likely to be pansy-ass compared to your fabricator HAL process. Hey, why not run a
Electronics Forum | Thu Aug 29 07:46:39 EDT 2002 | nifhail
Hello Experts We ran into problem today when one of the board that we assembled having problem at Test, BGA failure. The joints looks good but no continuity. When trying to remove the BGA, i found that the pad on the PCB is intact but black in colou
Electronics Forum | Mon Jan 03 16:34:10 EST 2005 | davef
The main advantage if ENIG over HASL is that ENIG is flat and HASL generally is not. The main disadvanages to ENIG over HASL are: * Cost of ENIG is 1.5 - 2X higher than HASL * Selflife is less than HASL * You solder to nickel, rather than copper * E
Electronics Forum | Fri Nov 23 16:09:01 EST 2007 | davef
We're not real clear about what you're trying to discuss, because most capacitors are packaged in epoxy with a solderable termination on each end. But lets throw a couple of ideas at the wall and see what sticks. If this epoxy is: * From the capaci
Electronics Forum | Fri Aug 21 07:38:34 EDT 1998 | Tryin'
| | Will somebody please explain HASL (here). Thanks. | Tryin: HASL: Hot Air Solder Leveled. A board fabrication process that applies an oxidation preventing solder coating to copper pads on the board. Dave F You do this to keep the green stuff (
Electronics Forum | Fri Dec 06 10:16:57 EST 2002 | davef
Bare board cleanliness is still primarily measured by resistivity of solvent extract (ROSE) using instruments such as Omegameters and Zero Ions. What is considered as "acceptable" cleanliness varies between specification and from company to company.
Electronics Forum | Tue Jul 29 09:47:40 EDT 2003 | davef
We agree with Russ and Ioan that rework does not cause black pad. It's caused during the board fabrication process. On the other hand, we think: * Mantis wants to reduce the amount of reworking of boards that fail due to a black pad problem. *
Electronics Forum | Tue May 25 10:16:03 EDT 2004 | Bimal Patel
We are doing assemblies using Immersion Silver coating for RF assembly for a while now. We did not have problem using 63/37 SN/PB solder paste untill recently. We started seeing black marks on the finish and around the solder joint recently. We have
Electronics Forum | Tue May 25 10:16:07 EDT 2004 | Bimal Patel
We are doing assemblies using Immersion Silver coating for RF assembly for a while now. We did not have problem using 63/37 SN/PB solder paste untill recently. We started seeing black marks on the finish and around the solder joint recently. We have
