Electronics Forum: flex and bga (Page 3 of 42)

GSM2 and FlexJet heads

Electronics Forum | Fri Mar 19 10:04:51 EDT 2010 | dilogic

Thanks for the explanation - it's hard to get any information from UIC when it comes to the older equipment, so I am stucked to this forum. Can you maybe give me a hint where to ask for such conversion kit?

BGA rework and reliability

Electronics Forum | Thu Oct 22 11:11:58 EDT 1998 | Hon

Dear all, What are your views on reworking BGA's? I mean, with the BGA going through reflow temperatures four times or more, and with a manual reballing process, wouldn't it raise up a few reliability issues? Would you consider not doing rework on

GSM2 and FlexJet heads

Electronics Forum | Thu Mar 18 18:52:29 EDT 2010 | edwaterfall01

There is a retrofit kit to take care of the head cable problem that you mention. The s/n with 7P in it represents what is called the 7 Plus level of the head. There was one more level after that (09) for the GSM. The better heads mentioned in the

0201 and uBGA

Electronics Forum | Wed Jun 05 17:13:58 EDT 2002 | Yannick

Hello! I have a strage problem, we made some production with uBGA, BGA, 0201, 0805, and other type of component. We didn't put the uBGA and 0201 and BGA on the board at the end of the line we look a our solder joint and surprise the solder made a

BGA lands and ICT

Electronics Forum | Tue Mar 19 17:30:46 EST 2002 | rculpepp

Does anyone have or know of any published guidelines for BGA layout on PWB's so that they can be tested. Specifically using micro vias? If anyone has any input regarding other test considerations for BGA devices I'd like to hear from you as well. W

BGA lands and ICT

Electronics Forum | Wed Mar 20 07:57:30 EST 2002 | davef

Purchase: 7095 - Design and Assembly Process Implementation for BGA's Make every effort to distribute the test pads, because if you keep them massed at the ball, it would be a bijundo kick in the BGA rear section, when all of those pins released.

Skewed and popped components

Electronics Forum | Wed Sep 24 08:34:57 EDT 2003 | stefwitt

Even when you run a board several times, the machine may not make the same travel path every time. This in itself does not create a problem, but the vacuum on the nozzles could be different, dependent on the configuration of components on the heads.

High-end SPI and AOI?

Electronics Forum | Tue Oct 13 22:56:22 EDT 2009 | cpcompany

Can anyone help me recommend or simulate a SPI > and AOI machine that can balance our FUJI NXT 1 > with 14 modules. We are using MPM accela printer. > 200 UPH is our target. > > Here's the PCB > dimension > > length(x) = 399.92mm width(y) = >

JUKI KE2060R and KE2060L

Electronics Forum | Mon Sep 21 04:23:16 EDT 2009 | smtbox

R series Features FCS (Flex Calibration System) highly regarded easy maintenance just got even easier! The optional FCS calibration jig is a simple to use system to re-calibrate placement accuracy. The machine automatically picks and places jig comp

BGA and Gold Boards

Electronics Forum | Fri Jun 19 09:45:21 EDT 1998 | Mike Cox

Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. Mike


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