Full Site - : fr4 bake recipes (Page 3 of 10)

Re: FR4 vs Polymide

Electronics Forum | Thu May 14 04:11:33 EDT 1998 | JACK CHEN

| Does the temp. profiles used to reflow double sided pcb's through a IR oven | on FR4 board material have to be re-established if it is changed to | polyimide? Boards will be baked out prior to assembly. | any response would be most appreciated.

Baking FR-4 PWB's prior to reflow

Electronics Forum | Tue Mar 21 17:32:48 EST 2000 | Charles Barker

Greetings all you knowledgable SMT persons! 1. Typically, for multi-layer (6-8 layers), FR4, SMT boards stored in an air conditioned environment at about 50+/- 10% RH, how many months (or years) would you allow to pass before you would recommend bak

Boards delaminated after wash

Electronics Forum | Tue Aug 14 15:45:06 EDT 2001 | davef

BOARD BAKING SCHEDULE: Bake time depends on the board thickness and construction. For laminated FR4 PCB, we bake between 6 and 24 hours at 100�C. ROOT CAUSE OF THE PROBLEM: Heating moisture entrapped between the laminations of the board too quickl

bga warp

Electronics Forum | Tue Sep 10 08:22:36 EDT 2002 | davef

I doubt that the interposer is FR4, it's more likely to be BT. Warp during reflow is a function of material a reflow recipe. Your ramp is too fast and is causing the interposer to bend like a potato chip.

Cu% spec for lead free HASL surface finish

Electronics Forum | Wed Nov 28 22:33:24 EST 2007 | davef

There is no specification for lead-free HASL. You can use any lead-free solderability protection that meets your customer requirements. Use IPC-9701 �Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments� to ass

Re: Baking FR-4 PWB's prior to reflow

Electronics Forum | Tue Mar 21 20:37:51 EST 2000 | Dave F

Charlie: I�d plan never bake boards. Check the SMTnet Archives. Dave F

Baking of PCB's/Flexes

Electronics Forum | Thu Oct 26 12:27:40 EDT 2000 | Dave Cunningham

What guidelines would you suggest for an assembly house concerning the baking of bare PCB's (assume FR4) and flexes/rigid-flexes before assembly.

baking out pcbs after reflow process

Electronics Forum | Thu Jul 12 02:15:53 EDT 2012 | thmeier

Check also the specs / recommendations of your PCB manufacturer. We bake boards 4h/120°C before reflow and after automated cleaning (it´s not FR4!) and also if we have to rework with the autometd rework- stations (massive IR underheating ,..). Regar

Bare PCB baking

Electronics Forum | Tue Nov 19 02:59:24 EST 2002 | yngwie

Hi Experts out there, pls help me with the following matters. How important is the bare PCB baking ? What is the temperature for baking @ what RH ? What would be the impact for the ENTEK finished board should the baking is really necessary ? For t

Polyamide

Electronics Forum | Mon Feb 15 14:30:00 EST 1999 | Dave Turner

| Any info on the pros and cons of FR4 or Polyamide ref the use of soldering PGAs would be helpful. ie. temp co-efficient diffs, baking, wave soldering, Convection reflow etc


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