High Tg FR4 Material 2.0 mm Thickness 6 Layers Immersion Gold Surface Treatment Green Solder Mask Carbon Ink
8-layer PCB with impedance control. Surface Finish: Immersion Gold
1). 6 oz (210μm) on BOT side. 2). 139.99*110.85mm=1 pcb 3). Base material: FR-4 4). 4 Layer, 1.6mm thick 5). Green solder mask/ white legend 6). Immersion gold. 7). Stack-up ---------- OVERLAY (TOP) ---------- SOLDER MASK (TOP)
Layer: 2L Base Material:CEM-3 CTI300 Board Thickness: 1.6mm Final copper: 35um Surface Finish: Immersion Tin/Sn Solder mask: Green Silkscreen: white Profile: Routing + v-cut E-test: 100% Fixture Quality report: Solderability test, F
Specification: 8L(1+6+1) Material: FR-4 Board thickness: 1.0mm Final copper: 18um Solder mask color: Green Silkscreen: White Surface Finish: Immersion Gold Profile: Routing and stamp holes E-test: 100% Fixture Quality report: Solder
Material: FR4 Layer Coverage: 6L Thickness: 1.6MM Surface Technique: HAL Leadfree Line Width/Space: 6mil/6mil Solder Mask Color: Green Special:BGA.Impendance
FR-4 Material 2. 4 mm Thickness 3OZ base Cu 10 Layers Immersion Gold Surface Treatment Green Solder Mask
Material: FR4 Layer Coverage: 12L Thickness: 3.2MM Surface Technique: Immersion Gold Line Width/Space: 12mil/12mil Solder Mask Color: Green
FR-4 Material 1.6 mm Thickness 12 Layers Immersion Gold Surface Treatment 0.2mm Drill Green Solder Mask Color BGA, Impedance Control
1. FR-4 material, 1 oz copper finished 2. 6-12 layers, 5mm thick board 3. Green solder mask /white silk screen. 4. Blind/buried vias required. 5. Hot air level Pb free 6. Application: motor, medical equipment, industrial products.
