Electronics Forum | Thu Jan 13 13:16:40 EST 2000 | Dave F
Tony: You have choices: * Hi Temperature Tape: Go with Wolfgang ... too tough to control. * Selective Soldering Pallets: Some like 'em some don't. A lot of your success depends on the pallet fabricator. * Screenable Temporary Solder Mask: Wol
Electronics Forum | Thu Sep 19 17:14:02 EDT 2002 | davef
Comments are: * Use an eraser if the surface of Au is not clean, but make sure the eraser has no/low ionics (such as sulfur that is a common additive for rubber). * If the plating surface required eraser to remove the top surface, the plasma normally
Electronics Forum | Mon Jan 07 20:37:15 EST 2002 | davef
For soldered areas, we like to keep gold thickness substantially below the maximum you propose. Search the fine SMTnet Archives for our discussions on the topic of acceptable levels of gold with solder connections. Let�s fix this �no one seems be s
Electronics Forum | Mon Jan 25 21:43:04 EST 1999 | Dave F
| hi, | i am working towards developing a no-clean process for a customer at contract manufacturing facility. the assemblies have gold fingers on them. these are masked to prevent from any damage to them during reflow soldering. the earlier proces
Electronics Forum | Mon Sep 23 12:42:15 EDT 2002 | dragonslayr
yea - yippie- Scott's the man!!!! good answer - I support the notion that in the long run, stopping the line, getting the root cause determination, is not only effective but efficient. It is hard to do because we all are so used to fire fighting on
Electronics Forum | Sun Jan 31 23:03:57 EST 1999 | Dennis O.
| | hi, | | i am working towards developing a no-clean process for a customer at contract manufacturing facility. the assemblies have gold fingers on them. these are masked to prevent from any damage to them during reflow soldering. the earlier pr
Electronics Forum | Wed Jan 09 12:20:00 EST 2002 | mregalia
Thanks for cluing me into IPC-2221. Though the numbers they give seem to contradict what I have learned from people working with the materials. At least I now know where the guideline for a max of 30 microinches of gold for soldering comes from. But
Electronics Forum | Mon Jun 18 04:21:22 EDT 2012 | brettrenishaw
Measured the pot temprature independantly from the software (268C/514F from moving wave). We are using Dross Inhibiter Tin/P Regenerator from BLT. Monthly sample checks are carried out on the solder bath and are all within limits. It will be hard to
Electronics Forum | Tue Jul 18 16:49:49 EDT 2023 | mahasg
Hello All, I am PhD student at polytechnique Montreal. We have a CQFP44 packages and Dies of 51um pad pitch (22nm FDSOI tech) that I need to bond myself at the university using ASM Eagle Xtreme gold wire bonder in the university. we need to perform b
Electronics Forum | Fri Feb 17 07:23:29 EST 2017 | sevenfortyone
I'm a PCB designer working on a board that has a rubber keypad with control buttons mounted to it. The PCB contains the corresponding contact patterns for the buttons - a typical interlocking finger pattern. In the past when I've encountered this
