Electronics Forum: hips (Page 3 of 3)

High complex board manufacturing

Electronics Forum | Mon Mar 02 04:20:27 EST 2009 | emmanueldavid

Glossy/Matte & Plating). 2. Select Solder Paste according to Your Customer or In-House Specifications which is compatible for expected Process. 3. Use Chemical Etch / Electro Polished Stencil with proper Aspect Ratios (AR=>1.5) & Area Ratios(ArR=>0.6

Re: 0603 Components

Electronics Forum | Mon Sep 11 04:10:46 EDT 2000 | Jim Arnold

I spent 25 years operating my own hybrid shop working with surface mount components, soldering materials and procedures. Dealing all the while with it's associated surprises and problems such as yours. Now-a-days I get paid to investigate and attemp

Re: Should Be Kleenox

Electronics Forum | Fri Aug 28 22:15:33 EDT 1998 | Steve Gregory

Chrys wrote: | Sorry to be so long winded. I was out most of the summer and I missed the forum. I promise my next posting will be shorter. Alright Chrys....(hands on hips and tapping foot), just where the heck were you? Did you bother to tell anybo

Re: Where's Earl Moon ?

Electronics Forum | Tue May 09 17:17:17 EDT 2000 | Earl Moon

Armin, Wolfey, Dave, Jeff, and some others I remember well who have moved on too (way too many to count but all left unfufilled here), I am back. No, just kidding. I still look in from time to time. All of you on the forum are great. I simply decide

Re: PASTE LEACHING

Electronics Forum | Sat May 06 08:46:46 EDT 2000 | Dave F

Sal: Now you�re talkin�, buddy!!! Darrell is correct. All things being equal, thermal relieved vias (and through holes) should be the hottest spot on the board at reflow temperatures. Vias are gonna take on solder like drippin�s take to biscuits.

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