Industry News | 2016-07-02 06:40:16.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.
Industry News | 2016-08-23 16:30:00.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, MBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.76, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 11 worldwide SHENMAO Technology locations.
Industry News | 2002-07-16 18:58:23.0
GiveMePower and At Work Computers Partner
Industry News | 2013-10-04 16:59:24.0
JUKI released LED Mounter JX-300LED, a specialized model with efficient function and performance for LED board production.
Industry News | 2013-11-15 18:24:38.0
According to the MIT Technology Review, the biggest productivity gains in electronics manufacturing and other industries today are being fueled by “robots, automation and software”. In its June 2013 issue, the magazine cited a study showing a diverging gap between rising industrial productivity and flat long-term employment dating back to 2000. Although controversial, it is an observation that fits well with the future roadmap of MYDATA, the global SMT innovator, which continues to bring “productivity boosters” to the SMT industry across many application areas.
Industry News | 2014-02-20 20:04:17.0
Embedded systems in the areas of medical, digital signage, gaming, video conferencing and industrial automation need outstanding CPU and graphics performance but are constrained by either size or thermal management. ADLINK Technology's new offering, the cExpress-HL COM Express® Type 6 Compact size computer-on-module (COM), takes full advantage of the Mobile 4th Generation Intel® Core™ Processor (formerly known as "Haswell-ULT") to provide a compact, high-performance COM solution with outstanding graphics capabilities.
Industry News | 2017-01-20 20:03:05.0
ADLINK Technology introduces its VPX3010 Series rugged 3U VPX processor blade with 12-core Intel® Xeon® Processor D-1500 SoC for server-grade computing performance. A VPX3010 quick start kit and GPGPU companion products, such as an optional discreet VPX GPGPU blade or XMC module with the 384 CUDA core NVIDIA GeForce GT 745M GPU, help to reduce development risk and enhance the capabilities of the blade.
Industry News | 2021-01-12 09:13:33.0
Expanded Line of CDE's NHR-Slimpack High-Temperature Prismatic Capacitors are released by New Yorker Electronics
Industry News | 2006-05-11 09:34:07.0
Purchase of Danish TraceXpert Concluded
Industry News | 2014-01-27 23:30:28.0
ADLINK Technology announced its new Matrix MXE-5400 fanless embedded computer with industry-leading performance, based on 4th Gen Intel® Core™ i7-4700EQ quad-core processor. The MXE-5400 delivers outstanding performance, excellent manageability, optimized connectivity, and rugged design in a compact package.
