Electronics Forum | Wed Dec 08 11:12:07 EST 1999 | Brian W.
I think the number is about 80 degrees C. If the board is hotter than that, glue problems start to occur. John is right. The adhesive starts its cure process and its release from the nozzle is inhibited. Fans and coolers are one way yo go. If yo
Electronics Forum | Fri Nov 19 03:40:30 EST 1999 | JohnW
Folk's, I'm looking for information on moisture sensitive devices for our trainer's to use when explaining the concept to new recruit's. There seem's to be load's and load's of info available to ESD but very little for MSD, so I thought I'd ask the
Electronics Forum | Thu Oct 14 07:55:48 EDT 1999 | JohnW
Sorry Dave should have said... At the mo all my data is for no clean processes using both matte and gloss finishes. That doesn't mean your feedback has to be limited to this area, I'm really trying to find out what the rest of the world are doing if
Electronics Forum | Mon Aug 09 20:12:24 EDT 1999 | JohnW
Folk's, I'm looking for some helpful suggestions for reworking wave soldered bottomside components that have been glued. I'm not a fan of the twist and break approach and as some of them either have a double dot or a slot configuration this tend's t
Electronics Forum | Sun Dec 21 23:17:54 EST 2003 | johnwnz
The SMART Group in the UK have a project that's been going for almost a year now where they are collating the PPM results for a range of companies and PCB complexities & publishing the averages as a bench mark for memebers. I hear that NEMI are now l
Electronics Forum | Tue Jul 06 10:12:44 EDT 1999 | John Thorup
| | Is the no clean solder paste as good? We are wondering if we can elliminate the wash when we change from through hole to surface mount. | | | John, | | No clean is as good as your process, and the paste you are using. Everything I do is no cle
Electronics Forum | Sat Oct 05 07:29:48 EDT 2002 | davef
Design for the Environment (DFE) / Electromagnetic Compliance (EMC) ------------------------------------------------------------------- "Noise Reduction Techniques in Electronic Systems" Henry W. Ott, John Wiley & Sons, New York, 1976 Seltzer, G.S.
Electronics Forum | Sat Mar 20 14:48:47 EST 1999 | John
Thanks guys, since I have no control as to who makes the board (probably the lowest bidder), I guess I'll keep the SOT's on top. Thanks for your help, John | John, | | SOT 23's on the bottom side is no real problem...as long as you get the orientai
Electronics Forum | Tue Jul 27 14:04:38 EDT 1999 | JohnW
| Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly app
Electronics Forum | Fri Sep 24 15:15:02 EDT 1999 | Bill
| | | | I need to put together some quickie training material | | | | for our customer service people. I've only got about 30 minutes | | | | to describe the SMT process in a nutshell, so it can't be lengthy and detailed. A ppt file would be best. |
